NDLI: Interfacial Characterization and Bonding Mechanism of Ultrasonic Wedge Bonding

Content Provider	IEEE Xplore Digital Library
Author	Hongjun Ji Mingyu Li Chunqing Wang
Copyright Year	2006
Description	Author affiliation: State Key Lab. of Adv. Welding Production Technol., Harbin Inst. of Technol. (Hongjun Ji)
Abstract	The joining mechanism of ultrasonic wedge bonding was investigated by chemical etching method. Compared to peeling-off method, the advantage of chemical etching method not only reflected the characters of the bond interface, but also indicated the physical process and bonding mechanism of the interconnection between the metal wire and metallization. It was found that the evolution and characters of the bond interface were affected heavily by the bonding parameters. The lateral and longitudinal joint marks were observed. The former were perpendicular to the direction of the ultrasonic vibration, and distributed at the periphery of the bond interface with some periodicity, which were the metallurgical joining parts. However, the later were parallel to the vibration directions locating at the bond center. The features above had important influence on the bond resistance. The mechanism was ascribed to the stress evolution and distribution during bonding process
Starting Page	1
Ending Page	5
File Size	5676907
Page Count	5
File Format	PDF
ISBN	1424406196
DOI	10.1109/ICEPT.2006.359760
Language	English
Publisher	Institute of Electrical and Electronics Engineers, Inc. (IEEE)
Publisher Date	2006-08-26
Publisher Place	China
Access Restriction	Subscribed
Rights Holder	Institute of Electrical and Electronics Engineers, Inc. (IEEE)
Subject Keyword	Bonding Wire Displacement measurement Stress measurement Ultrasonic variables measurement Chemical technology Etching Gold Welding Metallization
Content Type	Text
Resource Type	Article

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