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Content Provider | IEEE Xplore Digital Library |
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Author | Xiaoqiang Xie Lei Wang Taekoo Lee |
Copyright Year | 2006 |
Description | Author affiliation: Samsung Semicond. (China) R&D Co. Ltd, Suzhou (Xiaoqiang Xie; Lei Wang; Taekoo Lee) |
Abstract | The Sn3.0Ag0.5Cu solder joints with a 500mum diameter on the Ni/Au and Cu-OSP pad finish were tested in board level drop test defined by the JESD22-B111. 100, 300 and 500 hours HTS(high temperature storage) test at 125 degC were performed to evaluate the drop test life during aging. The IMC morphology during aging was investigated. For different pad finish, the drop failure mechanism was studied before and after HTS test. For OSP pad finish, a $Cu_{3}Sn$ layer with Kirkendall voids was thought to be the main failure factor during drop test. IMC thickness was thought not to be a key factor for drop test life |
Starting Page | 1 |
Ending Page | 4 |
File Size | 3401717 |
Page Count | 4 |
File Format | |
ISBN | 1424406196 |
DOI | 10.1109/ICEPT.2006.359772 |
Language | English |
Publisher | Institute of Electrical and Electronics Engineers, Inc. (IEEE) |
Publisher Date | 2006-08-26 |
Publisher Place | China |
Access Restriction | Subscribed |
Rights Holder | Institute of Electrical and Electronics Engineers, Inc. (IEEE) |
Subject Keyword | Failure analysis Soldering Gold Life testing High temperature superconductors Circuit testing Semiconductor device testing Aging Morphology Performance evaluation |
Content Type | Text |
Resource Type | Article |
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