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Content Provider | IEEE Xplore Digital Library |
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Author | Soo Yeol Kim Tae-Sung Oh Won Jong Lee Young-Ho Kim |
Copyright Year | 2006 |
Description | Author affiliation: Dept. of Mater. Sci. & Eng., Hanyang Univ., Seoul (Soo Yeol Kim) |
Abstract | The low temperature and ultra fine pitch chip on glass (COG) bonding using non-conductive adhesive (NCA) was developed. 30 mum pitch Sn bumps on Si chip were bonded with the metal pads on the glass substrate at 80 degC. Reflowed Sn bumps were used to reduce the NCA trapping. The initial contact resistance of the bump joints at 80 MPa pressure was less than 30 mOmega, which was lower than that of the joints using anisotropy conductive film (ACF). Aging treatment at 85 degC slightly decreased the contact resistance. Failed COG joints were not observed before and after aging |
Starting Page | 1 |
Ending Page | 4 |
File Size | 3808575 |
Page Count | 4 |
File Format | |
ISBN | 1424406196 |
DOI | 10.1109/ICEPT.2006.359782 |
Language | English |
Publisher | Institute of Electrical and Electronics Engineers, Inc. (IEEE) |
Publisher Date | 2006-08-26 |
Publisher Place | China |
Access Restriction | Subscribed |
Rights Holder | Institute of Electrical and Electronics Engineers, Inc. (IEEE) |
Subject Keyword | Temperature Nonconductive adhesives Flip chip Glass Bonding Tin Contact resistance Aging Substrates Anisotropic magnetoresistance |
Content Type | Text |
Resource Type | Article |
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