NDLI: Filler Contents Effects on the Moisture Absorption and Viscoelasticity of Thermosetting IC Packaging Polymers

Content Provider	IEEE Xplore Digital Library
Author	Xiaosong Ma Jansen, K.M.B. Zhang, G.Q. Ernst, L.J.
Copyright Year	2006
Description	Author affiliation: Delft Univ. of Technol. (Xiaosong Ma; Jansen, K.M.B.; Zhang, G.Q.; Ernst, L.J.)
Abstract	Four types of polymer which were selected are EPN1180 and EPN1180 filled with, 40%, 50%, and 65% fused silica. The moisture absorption is carried out in an adjustable thermal and humidity chamber at different temperature and humidity. The diffusion coefficients at different conditions were obtained through the early stage moisture absorption tests. The moisture absorption was revealed to show the Fickian type of diffusion for four types of samples. In addition the most important issue, the relation between moisture content and filler content is discussed and is revealed. Using this relation, the authors can expect moisture content in the sample with different moisture contents under different temperature and relative humidity conditions. Another issue, the relation between the viscoelasticity and filler content, is revealed. The authors find that the filler has a great effect on the viscoelasticity. The storage modulus is increased 30% by adding 65wt% fused silica
Starting Page	1
Ending Page	5
File Size	5664726
Page Count	5
File Format	PDF
ISBN	1424406196
DOI	10.1109/ICEPT.2006.359738
Language	English
Publisher	Institute of Electrical and Electronics Engineers, Inc. (IEEE)
Publisher Date	2006-08-26
Publisher Place	China
Access Restriction	Subscribed
Rights Holder	Institute of Electrical and Electronics Engineers, Inc. (IEEE)
Subject Keyword	Moisture Absorption Viscosity Elasticity Integrated circuit packaging Polymers Humidity Silicon compounds Temperature Testing
Content Type	Text

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