NDLI: Mechanical Characterization of Microelectronics Embedded in Flexible Substrate

Content Provider	IEEE Xplore Digital Library
Author	Wang, L. Zoumpoulidis, T. Bartek, M. Polyakov, A. Jansen, K.M.B. Ernst, L.J.
Copyright Year	2006
Description	Author affiliation: Dept. of Precision & Micro-Syst. Eng., Delft Univ. of Technol. (Wang, L.; Zoumpoulidis, T.; Bartek, M.; Polyakov, A.; Jansen, K.M.B.; Ernst, L.J.)
Abstract	The acceptable flexibility for ultra-thin substrate would be reached by embedding the ultra-thin substrate into the flexible polyimide and patterning the poly-silicon or silicon into square/hexagon segmentations. The segments interconnect by metal wires for the signal communication, different wire shapes are designed to reach more flexible. In this contribution, results of FE optimization on mechanical reliability issues of interconnect in-between segments on ultra-thin polyimide/silica rubber substrates are presented. Generation of cracks within the silicon and dielectric layers is then studied under controlled bending (glass cylinders with diameters of 2-10 mm, compressive and tensile stress) using specially for this purpose designed bending tools. Specimen observation is done using an optical microscope with possibility of digital recording and evaluation by pattern recognition software. The results show that the cracks appear first in the dielectric layers in-between the silicon layer segments and only at higher loads propagate or are generated within the silicon itself. The development of first cracks depends significantly on the silicon layer segmentation size which affects both the crack density and the crack width. The crack density increases sharply with the strain for early stage and then increases slightly. The crack width increases steadily. The high flexibility result can be reached that no crack be detected under the bending tests with 2 mm diameters. Multilevel FEM simulations are performed in order to increase understanding of the major failure processes. Results of simulations and experiments compare quite well. Second generation samples are designed with consideration of interconnect in-between segments and avoid of silicon dioxide in-between segments
Starting Page	1
Ending Page	7
File Size	6805062
Page Count	7
File Format	PDF
ISBN	1424406196
DOI	10.1109/ICEPT.2006.359825
Language	English
Publisher	Institute of Electrical and Electronics Engineers, Inc. (IEEE)
Publisher Date	2006-08-26
Publisher Place	China
Access Restriction	Subscribed
Rights Holder	Institute of Electrical and Electronics Engineers, Inc. (IEEE)
Subject Keyword	Microelectronics Polyimides Silicon compounds Dielectric substrates Optical microscopy Wires Shape Signal design Iron Rubber
Content Type	Text
Resource Type	Article

Sl.	Authority	Responsibilities	Communication Details
1	Ministry of Education (GoI), Department of Higher Education	Sanctioning Authority	https://www.education.gov.in/ict-initiatives
2	Indian Institute of Technology Kharagpur	Host Institute of the Project: The host institute of the project is responsible for providing infrastructure support and hosting the project	https://www.iitkgp.ac.in
3	National Digital Library of India Office, Indian Institute of Technology Kharagpur	The administrative and infrastructural headquarters of the project	Dr. B. Sutradhar bsutra@ndl.gov.in
4	Project PI / Joint PI	Principal Investigator and Joint Principal Investigators of the project	Dr. B. Sutradhar bsutra@ndl.gov.in Prof. Saswat Chakrabarti will be added soon
5	Website/Portal (Helpdesk)	Queries regarding NDLI and its services	support@ndl.gov.in
6	Contents and Copyright Issues	Queries related to content curation and copyright issues	content@ndl.gov.in
7	National Digital Library of India Club (NDLI Club)	Queries related to NDLI Club formation, support, user awareness program, seminar/symposium, collaboration, social media, promotion, and outreach	clubsupport@ndl.gov.in
8	Digital Preservation Centre (DPC)	Assistance with digitizing and archiving copyright-free printed books	dpc@ndl.gov.in
9	IDR Setup or Support	Queries related to establishment and support of Institutional Digital Repository (IDR) and IDR workshops	idr@ndl.gov.in

Mechanical characterization of microelectronics embedded in flexible and stretchable substrate

Mechanical Characterization Analysis of flexible and stretchable Ultra-Thin Substrates by Experiment and FE Simulation

Mechanical Characterization Analysis of a Segmented Silicon Layer on Ultra-thin Polyimide Substrates by Experiment and FE Simulation

Design and Fabrication of Micro-System Embedding in Flexible Substrates

Mechanical Characterization of Deformable Ultra-Thin Substrates by Experiment and FE Simulation

Flexible microstrip patch antenna using rubber substrate for WBAN applications

Silicon-substrate intracortical microelectrode arrays with integrated electronics for chronic cortical recording

Bending and stretching studies on ultra-thin silicon substrates

Polyimide - Substrate Bonding Studies Usinggamma-APS Coupling Agent

Mechanical Characterization of Microelectronics Embedded in Flexible Substrate

Similar Documents

Mechanical characterization of microelectronics embedded in flexible and stretchable substrate

Mechanical Characterization Analysis of flexible and stretchable Ultra-Thin Substrates by Experiment and FE Simulation

Mechanical Characterization Analysis of a Segmented Silicon Layer on Ultra-thin Polyimide Substrates by Experiment and FE Simulation

Design and Fabrication of Micro-System Embedding in Flexible Substrates

Mechanical Characterization of Deformable Ultra-Thin Substrates by Experiment and FE Simulation

Flexible microstrip patch antenna using rubber substrate for WBAN applications

Silicon-substrate intracortical microelectrode arrays with integrated electronics for chronic cortical recording

Bending and stretching studies on ultra-thin silicon substrates

Polyimide - Substrate Bonding Studies Usinggamma-APS Coupling Agent

Mechanical Characterization of Microelectronics Embedded in Flexible Substrate