NDLI: Low stress polymer die attach adhesive for plastic packages

Content Provider	IEEE Xplore Digital Library
Author	Chien, I.Y. Nguyen, M.N.
Copyright Year	1994
Description	Author affiliation: Johnson Matthey Electron. Inc., San Diego, CA, USA (Chien, I.Y.; Nguyen, M.N.)
Abstract	Silver filled epoxy is the most common type of adhesive used to attach Si chips to metal leadframes in plastic packages. However, with the attachment of larger die sizes (2 cm length on the side or larger) to thin copper lead frames now coming into routine use, most of the current adhesives were not reliable for these applications. Major technical issues of these materials are: stress-induced Si fracture; delamination at molding and post molding; device failures under pressure cooker tests and thermal shock tests; thermal/hydrolytic stability of adhesive; and narrow processing window. A novel thermoset cyanate ester die-attach paste has been developed to address the above issues. The paste is suitable for use on conventional dispensing equipment. This material can be cured in less than 60 seconds at 200/spl deg/C and does not generate any appreciable weight loss during cure. As a result, the same fast cure profile can be utilized for all die sizes. In this paper, we review the chemical and physical characteristics of the material and its functional performance as a die-attach media. The combination of a lower modulus of rigidity, about 400 MPa (vs. 1000 Mpa for conventional epoxies) and thermal stability at temperatures well above 300/spl deg/C has given the material excellent adhesive strength, even at 300/spl deg/C, as well as imparting very low stress on the die. Our data indicated the stress level is not sensitive to curing methods such as fast-curing on a heater block or slower-curing in a box oven. The stress level also does not change after long term high temperature at 150/spl deg/C or temperature cycles between -65/spl deg/C to 150/spl deg/C.<>
Starting Page	580
Ending Page	584
File Size	316411
Page Count	5
File Format	PDF
ISBN	0780309146
DOI	10.1109/ECTC.1994.367534
Language	English
Publisher	Institute of Electrical and Electronics Engineers, Inc. (IEEE)
Publisher Date	1994-05-01
Publisher Place	USA
Access Restriction	Subscribed
Rights Holder	Institute of Electrical and Electronics Engineers, Inc. (IEEE)
Subject Keyword	Polymers Microassembly Plastic packaging Thermal stresses Temperature sensors Materials testing Thermal stability Silver Lead Copper
Content Type	Text
Resource Type	Article

Sl.	Authority	Responsibilities	Communication Details
1	Ministry of Education (GoI), Department of Higher Education	Sanctioning Authority	https://www.education.gov.in/ict-initiatives
2	Indian Institute of Technology Kharagpur	Host Institute of the Project: The host institute of the project is responsible for providing infrastructure support and hosting the project	https://www.iitkgp.ac.in
3	National Digital Library of India Office, Indian Institute of Technology Kharagpur	The administrative and infrastructural headquarters of the project	Dr. B. Sutradhar bsutra@ndl.gov.in
4	Project PI / Joint PI	Principal Investigator and Joint Principal Investigators of the project	Dr. B. Sutradhar bsutra@ndl.gov.in Prof. Saswat Chakrabarti will be added soon
5	Website/Portal (Helpdesk)	Queries regarding NDLI and its services	support@ndl.gov.in
6	Contents and Copyright Issues	Queries related to content curation and copyright issues	content@ndl.gov.in
7	National Digital Library of India Club (NDLI Club)	Queries related to NDLI Club formation, support, user awareness program, seminar/symposium, collaboration, social media, promotion, and outreach	clubsupport@ndl.gov.in
8	Digital Preservation Centre (DPC)	Assistance with digitizing and archiving copyright-free printed books	dpc@ndl.gov.in
9	IDR Setup or Support	Queries related to establishment and support of Institutional Digital Repository (IDR) and IDR workshops	idr@ndl.gov.in

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