NDLI: Reliable Au-Sn flip chip bonding on flexible prints

Content Provider	IEEE Xplore Digital Library
Author	Baggerman, A.F.J. Batenburg, M.J.
Copyright Year	1994
Description	Author affiliation: Philips Centre for Manuf. Technol., Eindhoven, Netherlands (Baggerman, A.F.J.; Batenburg, M.J.)
Abstract	Au-Sn flip chip bonding is successfully introduced for the mounting of integrated circuits on flexible polyimide prints. Flip chip was used, since in most consumer electronics, and more specific for hearing instruments the useable volume is decreasing very rapidly. Since on the same flex print reflow soldering of other components is required, a high melting soldering process is preferred. An additional advantage of the Au-Sn process is that the bumps do not completely melt, and a certain stand off height is guaranteed. The bumps are deposited on top of the bondpads and are bonded to Cu tracks on a polyimide foil. The required Sn is either deposited on the bump or on the Cu tracks. Both Au-Sn soldering processes are performed by using pulsed heat thermode (gang) bonding. It is found that the quality of the bonds depends on the microstructure formed in the bonding region. EDX measurements indicate that for good quality bonds eutectic (80/20) Au-Sn or /spl zeta/'phases are required. To obtain these phases the temperature at the interface and the initial amount of Sn are optimized.<>
Starting Page	900
Ending Page	905
File Size	653420
Page Count	6
File Format	PDF
ISBN	0780309146
DOI	10.1109/ECTC.1994.367522
Language	English
Publisher	Institute of Electrical and Electronics Engineers, Inc. (IEEE)
Publisher Date	1994-05-01
Publisher Place	USA
Access Restriction	Subscribed
Rights Holder	Institute of Electrical and Electronics Engineers, Inc. (IEEE)
Subject Keyword	Flip chip Bonding Polyimides Tin Integrated circuit reliability Consumer electronics Auditory system Instruments Reflow soldering Microstructure
Content Type	Text
Resource Type	Article

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