NDLI: Flow analysis of semiconductor encapsulating material

Content Provider	IEEE Xplore Digital Library
Author	Tanaka, A. Asano, T. Oizumi, S. Niwa, K. Nishioka, T.
Copyright Year	1994
Description	Author affiliation: Prod. Eng. Res. Lab., Nitto Denko Corp., Toyohashi, Japan (Tanaka, A.; Asano, T.)
Abstract	Plastic package is currently the most popularly used process for encapsulating semiconductor packages. At present, transfer molding is the leading method in the world. New packages such as TSOP, TQFP and BGA require new technology because of their difficulty as compared to older package such as DIP and SOP. Some packages show various molding problems such as wire sway, voids, etc. In order to reduce such defects, adjustments in molding parameters as well as adjustments in the property of molding compound, on the basis of trial-and-error prevail. Normally, parameters such as spiral flow, gel time and flow-tester viscosity are used to explain such phenomenon. These trial-and-error adjustments lead to delays in correcting problem. Using our background experience we devised a mold support system in order to fully understand the relationship between the molding phenomenon, molding parameters, properties of molding compound and its formulation. In this study, we applied C-SET that is the simulating software of the flow mechanism with thermosetting provided by AC Technology. Initially we prepare several molding compounds each having its own fluidity property formulation for this study.<>
Starting Page	134
Ending Page	140
File Size	578501
Page Count	7
File Format	PDF
ISBN	0780309146
DOI	10.1109/ECTC.1994.367640
Language	English
Publisher	Institute of Electrical and Electronics Engineers, Inc. (IEEE)
Publisher Date	1994-05-01
Publisher Place	USA
Access Restriction	Subscribed
Rights Holder	Institute of Electrical and Electronics Engineers, Inc. (IEEE)
Subject Keyword	Semiconductor materials Semiconductor device packaging Viscosity Spirals Computational modeling Plastic packaging Electronics packaging Wire Resins Production engineering
Content Type	Text
Resource Type	Article

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1	Ministry of Education (GoI), Department of Higher Education	Sanctioning Authority	https://www.education.gov.in/ict-initiatives
2	Indian Institute of Technology Kharagpur	Host Institute of the Project: The host institute of the project is responsible for providing infrastructure support and hosting the project	https://www.iitkgp.ac.in
3	National Digital Library of India Office, Indian Institute of Technology Kharagpur	The administrative and infrastructural headquarters of the project	Dr. B. Sutradhar bsutra@ndl.gov.in
4	Project PI / Joint PI	Principal Investigator and Joint Principal Investigators of the project	Dr. B. Sutradhar bsutra@ndl.gov.in Prof. Saswat Chakrabarti will be added soon
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