NDLI: Low cost design of a high performance MCM

Content Provider	IEEE Xplore Digital Library
Author	Scannell, R.K.
Copyright Year	1994
Description	Author affiliation: Rockwell Int. Corp., Anaheim, CA, USA (Scannell, R.K.)
Abstract	A highly successful MultiChip Module (MCM) processor family, demonstrating advanced microelectronics packaging technologies, was developed for a wide range of applications. The technical success of the modules, however, was diminished by their high price. The cost problem was attributed to still immature technologies and support in the areas of: known-good-die, substrate manufacturing, minimal standardization, over-designing due to lack of qualification and test data and of course, the lack of high-volume orders. These high-cost modules have been the focus of an intensive cost reduction effort aimed at reducing the module cost by at least an order of magnitude over the next few years. The same design architecture has been studied for implementation in MCM-D, MCM-C, MCM-L, and possible combination approaches. Alternatives in known-good-die, next-level packaging, test, and assembly have been studied as well. Open dialogues with participating vendors has been emphasized to identify the "most producible" design specification that meets the size, performance, and cost goals.<>
Starting Page	810
Ending Page	819
File Size	775486
Page Count	10
File Format	PDF
ISBN	0780309146
DOI	10.1109/ECTC.1994.367577
Language	English
Publisher	Institute of Electrical and Electronics Engineers, Inc. (IEEE)
Publisher Date	1994-05-01
Publisher Place	USA
Access Restriction	Subscribed
Rights Holder	Institute of Electrical and Electronics Engineers, Inc. (IEEE)
Subject Keyword	Costs Packaging Signal processing Testing Throughput Multichip modules Process design Digital signal processors Microelectronics Manufacturing
Content Type	Text
Resource Type	Article

Sl.	Authority	Responsibilities	Communication Details
1	Ministry of Education (GoI), Department of Higher Education	Sanctioning Authority	https://www.education.gov.in/ict-initiatives
2	Indian Institute of Technology Kharagpur	Host Institute of the Project: The host institute of the project is responsible for providing infrastructure support and hosting the project	https://www.iitkgp.ac.in
3	National Digital Library of India Office, Indian Institute of Technology Kharagpur	The administrative and infrastructural headquarters of the project	Dr. B. Sutradhar bsutra@ndl.gov.in
4	Project PI / Joint PI	Principal Investigator and Joint Principal Investigators of the project	Dr. B. Sutradhar bsutra@ndl.gov.in Prof. Saswat Chakrabarti will be added soon
5	Website/Portal (Helpdesk)	Queries regarding NDLI and its services	support@ndl.gov.in
6	Contents and Copyright Issues	Queries related to content curation and copyright issues	content@ndl.gov.in
7	National Digital Library of India Club (NDLI Club)	Queries related to NDLI Club formation, support, user awareness program, seminar/symposium, collaboration, social media, promotion, and outreach	clubsupport@ndl.gov.in
8	Digital Preservation Centre (DPC)	Assistance with digitizing and archiving copyright-free printed books	dpc@ndl.gov.in
9	IDR Setup or Support	Queries related to establishment and support of Institutional Digital Repository (IDR) and IDR workshops	idr@ndl.gov.in

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