NDLI: Capacitance monitoring while flex testing

Content Provider	IEEE Xplore Digital Library
Author	Bergenthal, J. Prymak, J.D.
Copyright Year	1994
Description	Author affiliation: KEMET Electron. Corp., Greenville, SC, USA (Bergenthal, J.; Prymak, J.D.)
Abstract	As most other modes of failure have been dramatically reduced over the years, cracking due to stresses from boards bending have gained prominence. The common printed circuit board (PCB) built of G10 or FR-4 glass epoxy materials will easily bend under moderate forces. Almost all processes involved in populating these boards can involve bending the board - many times unknowingly. The bending of the board causes forces to be transmitted through the solder attach fillets to the surface mount chip. These forces are concentrated at the bottom of the chip, where the termination bands end. The mass of solder is important as this material is malleable, and slight amounts will move more freely. Forces applied very slowly will also allow the solder to stretch and absorb some ofthe force. The ceramic material is hard, non-elastic, and brittle. The shear force pulling at the ceramic along the termination edge will lead to a crack if the forces are sufficient. At what force the chip cracks is thought to be dependent upon the ceramic material, the amount of solder, the termination material and amounts, and possible defects or anomalies within the ceramic structure. In this context, the authors describe flex, bend, or warp testing which was instituted to detect a susceptibility to these forces.<>
Starting Page	854
Ending Page	860
File Size	715870
Page Count	7
File Format	PDF
ISBN	0780309146
DOI	10.1109/ECTC.1994.367528
Language	English
Publisher	Institute of Electrical and Electronics Engineers, Inc. (IEEE)
Publisher Date	1994-05-01
Publisher Place	USA
Access Restriction	Subscribed
Rights Holder	Institute of Electrical and Electronics Engineers, Inc. (IEEE)
Subject Keyword	Capacitance Stress Ceramics Communication cables Lead Electrodes Condition monitoring Circuit testing Flexible printed circuits Glass
Content Type	Text
Resource Type	Article

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1	Ministry of Education (GoI), Department of Higher Education	Sanctioning Authority	https://www.education.gov.in/ict-initiatives
2	Indian Institute of Technology Kharagpur	Host Institute of the Project: The host institute of the project is responsible for providing infrastructure support and hosting the project	https://www.iitkgp.ac.in
3	National Digital Library of India Office, Indian Institute of Technology Kharagpur	The administrative and infrastructural headquarters of the project	Dr. B. Sutradhar bsutra@ndl.gov.in
4	Project PI / Joint PI	Principal Investigator and Joint Principal Investigators of the project	Dr. B. Sutradhar bsutra@ndl.gov.in Prof. Saswat Chakrabarti will be added soon
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9	IDR Setup or Support	Queries related to establishment and support of Institutional Digital Repository (IDR) and IDR workshops	idr@ndl.gov.in

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