NDLI: A photosensitive-BCB on laminate technology (MCM-LD)

Content Provider	IEEE Xplore Digital Library
Author	Strandjord, A.J.G. Heistand, R.H. Bremmer, J.N. Garrou, P.E. Tessier, T.G.
Copyright Year	1994
Description	Author affiliation: Microelectron. Res., Dow Chem. Co., Midland, MI, USA (Strandjord, A.J.G.; Heistand, R.H.; Bremmer, J.N.)
Abstract	As Multichip Module (MCM) technology has evolved from research to commercial production, cost has become the important issue for implementation. Manufacturing schemes are incorporating those processes and materials which take advantage of the most cost effective technologies to meet the specific performance requirements for a given application. The work described in this paper demonstrates how laminate based MCM technology (MCM-L) and deposited dielectric technology (MCM-D) can be combined to form a low cost solution for systems requiring high density interconnections. The use of laminate board technology to fabricate the relatively low density interconnect portion of the multilayer structure, allows one to take advantage of the well established and highly cost competitive printed wiring board (PWB) industry. Deposited dielectric technology takes advantage of the high density capabilities, normally associated with MCM-D packaging, to increase performance. Benzocyclobutene (BCB) is a well suited dielectric material for a laminate/deposited dielectric application (MCM-LD) since it can be cured at relatively low temperatures (220-275/spl deg/C). Additionally, the use of BCB as the interlayer dielectric provides a stable copper/BCB interface, excellent planarization over rough topographies, and exhibits very low moisture absorption. Several low cost processing techniques were demonstrated as part of this MCM-LD program. These include an inherently photosensitive BCB formulation as the thin film dielectrics, meniscus coating as the large area deposition process for the photosensitive-BCB, and an in-line belt furnace for Rapid Thermal Curing (RTC). A two layer module was fabricated to demonstrate the feasibility of this MCM-LD process flow. This paper describes the processing issues and techniques associated with such a hybridized interconnection technology.<>
Starting Page	374
Ending Page	386
File Size	986671
Page Count	13
File Format	PDF
ISBN	0780309146
DOI	10.1109/ECTC.1994.367561
Language	English
Publisher	Institute of Electrical and Electronics Engineers, Inc. (IEEE)
Publisher Date	1994-05-01
Publisher Place	USA
Access Restriction	Subscribed
Rights Holder	Institute of Electrical and Electronics Engineers, Inc. (IEEE)
Subject Keyword	Laminates Costs Dielectric thin films Dielectric materials Multichip modules Production Manufacturing processes Nonhomogeneous media Wiring Textile industry
Content Type	Text
Resource Type	Article

Sl.	Authority	Responsibilities	Communication Details
1	Ministry of Education (GoI), Department of Higher Education	Sanctioning Authority	https://www.education.gov.in/ict-initiatives
2	Indian Institute of Technology Kharagpur	Host Institute of the Project: The host institute of the project is responsible for providing infrastructure support and hosting the project	https://www.iitkgp.ac.in
3	National Digital Library of India Office, Indian Institute of Technology Kharagpur	The administrative and infrastructural headquarters of the project	Dr. B. Sutradhar bsutra@ndl.gov.in
4	Project PI / Joint PI	Principal Investigator and Joint Principal Investigators of the project	Dr. B. Sutradhar bsutra@ndl.gov.in Prof. Saswat Chakrabarti will be added soon
5	Website/Portal (Helpdesk)	Queries regarding NDLI and its services	support@ndl.gov.in
6	Contents and Copyright Issues	Queries related to content curation and copyright issues	content@ndl.gov.in
7	National Digital Library of India Club (NDLI Club)	Queries related to NDLI Club formation, support, user awareness program, seminar/symposium, collaboration, social media, promotion, and outreach	clubsupport@ndl.gov.in
8	Digital Preservation Centre (DPC)	Assistance with digitizing and archiving copyright-free printed books	dpc@ndl.gov.in
9	IDR Setup or Support	Queries related to establishment and support of Institutional Digital Repository (IDR) and IDR workshops	idr@ndl.gov.in

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