NDLI: Evaluation of low temperature snap-cure die attach materials

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Evaluation of low temperature snap-cure die attach materials

Content Provider	IEEE Xplore Digital Library
Author	Mekdhanasarn, B. Chen, A.S. Lo, R.H.Y.
Copyright Year	1994
Abstract	Polymeric adhesive materials have been extensively used for die attachment in plastic IC package assembly for over two decades. They offer many advantages over gold-eutectic solder, soft solders, or silver-glass attach materials, due to lower temperature processing, lower stress on the chip, and lower cost. Recently, improved polymeric adhesive materials are entering the market. Snap-cure adhesives can reduce processing time and steps, which translates into cycle time reduction and cost savings. In addition, a lower temperature-cure material also provides compatibility with tin-lead solder pre-plated lead frames for assembly flow simplification, as well as for temperature sensitive devices. However, since these materials are relatively new, their effect on reliability of the encapsulated IC device is not well known, especially with respect to the volatile species evolved during cure and post-cure processing. The snap-cure adhesive chemistry differs from that of standard polymeric die attach materials. How that affects stress, thermal, and reliability behavior of the package requires study. This paper examines the differences in the material design of the snap-cure versus oven cure adhesives, and how that relates to assembly processability and package reliability. From the results, snap-cure die attach materials show comparable or superior performance to conventional polymeric die attach materials in these areas, which should aid their acceptance into the simplification of the plastic IC assembly flow.<>
Sponsorship	IEEE Computer Society
Starting Page	91
Ending Page	96
Page Count	6
File Size	665642
File Format	PDF
ISSN	10709894
Volume Number	17
Issue Number	1
Language	English
Publisher	Institute of Electrical and Electronics Engineers, Inc. (IEEE)
Publisher Date	1994-02-01
Publisher Place	U.S.A.
Access Restriction	Subscribed
Rights Holder	Institute of Electrical and Electronics Engineers, Inc. (IEEE)
Subject Keyword	Microassembly Polymers Assembly Costs Materials reliability Thermal stresses Plastic integrated circuit packaging Lead Temperature sensors Chemistry
Content Type	Text
Resource Type	Article
Subject	Engineering

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