NDLI: Development of molding compounds suited for copper leadframes

Content Provider	IEEE Xplore Digital Library
Author	Ohsuga, H. Suzuki, H. Aihara, T. Hamano, T.
Copyright Year	1994
Description	Author affiliation: Electron. Device Mater. Res. Lab., Sumitomo Bakelite Co. Ltd., Yokohama, Japan (Ohsuga, H.; Suzuki, H.; Aihara, T.; Hamano, T.)
Abstract	We conducted various studies on molding compounds for surface mount packages suitable for copper alloy leadframes. First, we examined the adhesion of molding compounds to copper alloys and found that the adhesion strength varies depending upon the kind of copper alloys and the degree of oxidation of their surfaces. It also interested us that the highest adhesion strength was achieved when the oxidation reached a certain degree. In the practical package assembly process we will be able to improve the reliability of packages by controlling heating of leadframes. Then we made a reliability test on packages. As for solder crack resistance, copper alloys are somewhat inferior to Alloy-42. Molding compounds whose adhesion strength to lead frame is higher have higher solder crack resistance. As for temperature cycle performance, copper alloys are obviously inferior to Alloy-42. Molding compounds with lower stress perform better in temperature cycle tests. Therefore, molding compounds with high adhesion and low stress are suitable for copper alloy leadframes. In the future, the more reliable packages shall be developed by improving die-attach paste (silver paste), the shape of leadframes (slit design), etc.<>
Starting Page	141
Ending Page	146
File Size	504900
Page Count	6
File Format	PDF
ISBN	0780309146
DOI	10.1109/ECTC.1994.367639
Language	English
Publisher	Institute of Electrical and Electronics Engineers, Inc. (IEEE)
Publisher Date	1994-05-01
Publisher Place	USA
Access Restriction	Subscribed
Rights Holder	Institute of Electrical and Electronics Engineers, Inc. (IEEE)
Subject Keyword	Copper alloys Lead Packaging Adhesives Oxidation Testing Stress Assembly Temperature control Heating
Content Type	Text
Resource Type	Article

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Characterization of oxidized copper leadframes and copper/epoxy molding compound interface adhesion in plastic package

Effect of oxidation on mold compound-copper leadframe adhesion

Adhesion behavior between epoxy molding compound and different leadframes in plastic packaging

Oxidation failure of Lead Frame Copper alloys with Surface Electroplated Pure Cu

The influence of heat treatment on the adhesion between molding compound and lead frame

Die attach adhesion on leadframes treated with antioxidants

The oxidation control of copper leadframe package for prevention of popcorn cracking

A method for evaluating delamination between epoxy moulding compounds and different plated leadframes

Oxidation of copper leadframe

Development of molding compounds suited for copper leadframes

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Die attach adhesion on leadframes treated with antioxidants

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