NDLI: Engineering the precompression of Bi,Pb(2223): the influence of the geometry of the metallic matrix on the mechanical properties of tapes

Content Provider	IEEE Xplore Digital Library
Author	Passerini, R. Dhalle, M. Witz, G. Seeber, B. Flukiger, R.
Copyright Year	2002
Abstract	At relatively low tensile strain (/spl epsiv/) levels, Bi,Pb(2223) tapes show a strain insensitive plateau In their I/sub c/(/spl epsiv/) behavior. The "Irreversible I/sub c/ Reduction Model" explains this regime as due to the irreversible damage caused by the precompression of the ceramic filaments by the metal matrix. In this paper we investigate whether this damage occurs predominantly during the cool-down from the reaction temperature to room temperature, or during the cryogenic refrigeration. Furthermore, we present I/sub c/(/spl epsiv/) data on a range or tapes with different superconductor-to-matrix ratio and different tape geometry, showing how these factors influence the precompression. A modification of the "Irreversible I/sub c/ Reduction Model" is proposed to take into account "connected-grains" domains in the I/sub c/(/spl epsiv/) behavior.
Sponsorship	Council on Superconductivity Appl. Superconductivity Conference Inc MIT
Starting Page	3018
Ending Page	3021
Page Count	4
File Size	453693
File Format	PDF
ISSN	10518223
Volume Number	11
Issue Number	1
Language	English
Publisher	Institute of Electrical and Electronics Engineers, Inc. (IEEE)
Publisher Date	2001-03-01
Publisher Place	U.S.A.
Access Restriction	One Nation One Subscription (ONOS)
Rights Holder	Institute of Electrical and Electronics Engineers, Inc. (IEEE)
Subject Keyword	Geometry Tensile strain Ceramics Filling Cooling Temperature measurement Capacitive sensors Mechanical factors Bismuth compounds Ultrasonic variables measurement
Content Type	Text
Resource Type	Article
Subject	Condensed Matter Physics Electronic, Optical and Magnetic Materials Electrical and Electronic Engineering

Sl.	Authority	Responsibilities	Communication Details
1	Ministry of Education (GoI), Department of Higher Education	Sanctioning Authority	https://www.education.gov.in/ict-initiatives
2	Indian Institute of Technology Kharagpur	Host Institute of the Project: The host institute of the project is responsible for providing infrastructure support and hosting the project	https://www.iitkgp.ac.in
3	National Digital Library of India Office, Indian Institute of Technology Kharagpur	The administrative and infrastructural headquarters of the project	Dr. B. Sutradhar bsutra@ndl.gov.in
4	Project PI / Joint PI	Principal Investigator and Joint Principal Investigators of the project	Dr. B. Sutradhar bsutra@ndl.gov.in Prof. Saswat Chakrabarti will be added soon
5	Website/Portal (Helpdesk)	Queries regarding NDLI and its services	support@ndl.gov.in
6	Contents and Copyright Issues	Queries related to content curation and copyright issues	content@ndl.gov.in
7	National Digital Library of India Club (NDLI Club)	Queries related to NDLI Club formation, support, user awareness program, seminar/symposium, collaboration, social media, promotion, and outreach	clubsupport@ndl.gov.in
8	Digital Preservation Centre (DPC)	Assistance with digitizing and archiving copyright-free printed books	dpc@ndl.gov.in
9	IDR Setup or Support	Queries related to establishment and support of Institutional Digital Repository (IDR) and IDR workshops	idr@ndl.gov.in

Effect of mechanical loading on the I/sub c/ degradation behavior of Bi-2223 tapes

Critical Current Degradation of Bi-2223 Composite Tapes Induced byCyclic Deformation and Fatigue-Related Effects

Effects of strain on the critical current of Bi-2223/Ag tapes

Deformation and I$_rm c$Degradation Behavior in Bent Bi-2223 Tapes Under Pressurized Liquid Nitrogen

Bending strain study of Bi-2223/Ag tapes using Hall sensor magnetometry

Transport critical currents of Bi(2223) tapes at 77 K under mechanical stress

Bent-beam strain sensors

Fatigue behavior of multifilamentary BSCCO 2223/Ag Superconducting tapes

Influence of transversal compressive strain on degradation of Bi2223 tapes

Engineering the precompression of Bi,Pb(2223): the influence of the geometry of the metallic matrix on the mechanical properties of tapes

Similar Documents

Effect of mechanical loading on the I/sub c/ degradation behavior of Bi-2223 tapes

Critical Current Degradation of Bi-2223 Composite Tapes Induced byCyclic Deformation and Fatigue-Related Effects

Effects of strain on the critical current of Bi-2223/Ag tapes

Deformation and I$_rm c$Degradation Behavior in Bent Bi-2223 Tapes Under Pressurized Liquid Nitrogen

Bending strain study of Bi-2223/Ag tapes using Hall sensor magnetometry

Transport critical currents of Bi(2223) tapes at 77 K under mechanical stress

Bent-beam strain sensors

Fatigue behavior of multifilamentary BSCCO 2223/Ag Superconducting tapes

Influence of transversal compressive strain on degradation of Bi2223 tapes

Engineering the precompression of Bi,Pb(2223): the influence of the geometry of the metallic matrix on the mechanical properties of tapes