NDLI: Microstructure and superconducting properties of Bi-2212/Ag tapes

Content Provider	IEEE Xplore Digital Library
Author	Zhu, W. Watson, D.R. Cave, J.R.
Copyright Year	2002
Abstract	In order to understand the effects of processing parameters on the formation of Bi-2212 phase and to improve superconducting properties, Bi2212 (nominal composition Bi/sub 2/Sr/sub 2/Ca/sub 1/Cu/sub 2/O/sub x/), sheathed with silver was fabricated and thermo-mechanically treated for this study. Scanning electron microscopy was employed to investigate the phases and microstructure at different stages of the Bi-2212 formation and in the final materials. A SQUID magnetometer was used to characterize the T/sub c/ of the conductors. Voltage-current (V-I) characteristics were measured with a standard four-probe method at 77 K in different magnetic fields in order to improve the correlation of magnetic properties to microstructural properties. The critical current density is /spl sim/15000 A/cm/sup 2/ at 77 K self field. The critical current distribution in the conductors was studied by computing the second differential of the VI curves and the correlation between the microstructure and the second differential was analyzed. The current transfer to the metal sheath and the effect of the sheath on the shape of the VI curve are discussed.
Sponsorship	Council on Superconductivity Appl. Superconductivity Conference Inc MIT
Starting Page	3030
Ending Page	3033
Page Count	4
File Size	536785
File Format	PDF
ISSN	10518223
Volume Number	11
Issue Number	1
Language	English
Publisher	Institute of Electrical and Electronics Engineers, Inc. (IEEE)
Publisher Date	2001-03-01
Publisher Place	U.S.A.
Access Restriction	One Nation One Subscription (ONOS)
Rights Holder	Institute of Electrical and Electronics Engineers, Inc. (IEEE)
Subject Keyword	Microstructure Superconducting films Conducting materials Magnetic field measurement Magnetic properties Bismuth Strontium Silver Thermomechanical processes Electrons
Content Type	Text
Resource Type	Article
Subject	Condensed Matter Physics Electronic, Optical and Magnetic Materials Electrical and Electronic Engineering

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