NDLI: Study of Excess Heat Capacity and Suppressed Kapitza Conductance in TES Devices

Content Provider	IEEE Xplore Digital Library
Author	Yue Zhao Appel, J. Chervenak, J.A. Doriese, W.B. Staggs, S.
Copyright Year	2002
Abstract	A number of groups have produced TES bolometers and other devices using dielectric membranes for thermal isolation in which excess heat capacity is reported. We have fabricated a series of TES devices using large area membranes and narrow legs for thermal isolation to study the scaling of intrinsic parameters like the heat capacity of the membrane. The devices are arranged on a single chip to ensure similarity of devices parameters (i.e., film thicknesses) and processing history. Measurements (non-multiplexed) of the current-voltage characteristic and complex impedance are made using a well-characterized, highly uniform, multichannel SQUID setup. We have developed model for non-ideal transition edge sensor performance that enables extraction of heat capacities and thermal conductances identified in the models. We report on the magnitude of excess heat capacity in the dielectric membrane and thermal conductance of the metal-to-dielectric interface in each of the designs.
Sponsorship	Council on Superconductivity Appl. Superconductivity Conference Inc MIT
Starting Page	227
Ending Page	231
Page Count	5
File Size	426946
File Format	PDF
ISSN	10518223
Volume Number	21
Issue Number	3
Language	English
Publisher	Institute of Electrical and Electronics Engineers, Inc. (IEEE)
Publisher Date	2011-06-01
Publisher Place	U.S.A.
Access Restriction	One Nation One Subscription (ONOS)
Rights Holder	Institute of Electrical and Electronics Engineers, Inc. (IEEE)
Subject Keyword	Heating Silicon Biomembranes Bolometers Leg Phonons Impedance transition edge sensor Bolometer heat capacity phonon
Content Type	Text
Resource Type	Article
Subject	Condensed Matter Physics Electronic, Optical and Magnetic Materials Electrical and Electronic Engineering

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