NDLI: Evaluation of interconnect technologies for power semiconductor devices

Content Provider	IEEE Xplore Digital Library
Author	Calata, J.N. Guo-Quan Lu Luechinger, C.
Copyright Year	2002
Description	Author affiliation: Dept. of Mater. Sci. & Eng., Virginia Polytech. Inst. & State Univ., Blacksburg, VA, USA (Calata, J.N.; Guo-Quan Lu)
Abstract	Electrical interconnection is an important part of device packaging. In packages of power semiconductor devices, wire bonding currently is the predominant interconnect technology; but other technologies such as flip chip, developed for IC chip packaging, and direct solder are being used in newly introduced products. The ever-increasing demand on performance and reliability of power electronics devices and systems has accelerated the research and development for interconnection and packaging. This project was initiated to objectively evaluate different technologies, commercial or developmental, in terms of performance, reliability, fabrication complexity and cost, with high sample-to-sample consistency and statistically significant sample sizes. Three interconnect technologies - wire bond, solder ball, and direct solder - were selected for the initial comparative study. Power devices were attached on direct bond copper (DBC) substrates of identical size, then interconnected by each of the three techniques into testable structures. Thermal cycling is performed under the JEDEC recommended conditions to allow cross-referencing with available data obtained under similar conditions. Monitoring will be done using nondestructive methods such as scanning acoustic microscopy and electrical tests. The procedures for the fabrication and evaluation of the test structures are presented, as are the preliminary experimental results obtained thus far. A description of the cost analysis methodology is also included.
Sponsorship	Components, Packaging, & Manuf. Technol. Soc. IEEE (CPMT/IEEE) K-16 Committee on Electron. Cooling, Heat Transfer Div. ASME Electron. & Photonics & Packaging Div. (EPPD), ASME Int. Microelectron. & Packaging Soc. (IMAPS)
Starting Page	1089
Ending Page	1096
File Size	955354
Page Count	8
File Format	PDF
ISBN	0780371526
ISSN	10899870
DOI	10.1109/ITHERM.2002.1012579
Language	English
Publisher	Institute of Electrical and Electronics Engineers, Inc. (IEEE)
Publisher Date	2002-05-30
Publisher Place	USA
Access Restriction	Subscribed
Rights Holder	Institute of Electrical and Electronics Engineers, Inc. (IEEE)
Subject Keyword	Power semiconductor devices Electronics packaging Semiconductor device packaging Bonding Power system interconnection Power system reliability Acoustic testing Integrated circuit packaging Wire Fabrication
Content Type	Text
Resource Type	Article

Sl.	Authority	Responsibilities	Communication Details
1	Ministry of Education (GoI), Department of Higher Education	Sanctioning Authority	https://www.education.gov.in/ict-initiatives
2	Indian Institute of Technology Kharagpur	Host Institute of the Project: The host institute of the project is responsible for providing infrastructure support and hosting the project	https://www.iitkgp.ac.in
3	National Digital Library of India Office, Indian Institute of Technology Kharagpur	The administrative and infrastructural headquarters of the project	Dr. B. Sutradhar bsutra@ndl.gov.in
4	Project PI / Joint PI	Principal Investigator and Joint Principal Investigators of the project	Dr. B. Sutradhar bsutra@ndl.gov.in Prof. Saswat Chakrabarti will be added soon
5	Website/Portal (Helpdesk)	Queries regarding NDLI and its services	support@ndl.gov.in
6	Contents and Copyright Issues	Queries related to content curation and copyright issues	content@ndl.gov.in
7	National Digital Library of India Club (NDLI Club)	Queries related to NDLI Club formation, support, user awareness program, seminar/symposium, collaboration, social media, promotion, and outreach	clubsupport@ndl.gov.in
8	Digital Preservation Centre (DPC)	Assistance with digitizing and archiving copyright-free printed books	dpc@ndl.gov.in
9	IDR Setup or Support	Queries related to establishment and support of Institutional Digital Repository (IDR) and IDR workshops	idr@ndl.gov.in

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