NDLI: Minimizing scatter in experimental data sets

Content Provider	IEEE Xplore Digital Library
Author	Stout, R.P.
Copyright Year	2002
Description	Author affiliation: Adv. Packaging Technol., ON Semicond., Phoenix, AZ, USA (Stout, R.P.)
Abstract	Thermal transient data collected to characterize packaged semiconductor devices is often acquired from a number of individual samples that then must be averaged together. Yet each individual transient curve has a relatively large experimental uncertainty which is usually a combination of unmeasurable initial transient thermal response (related to electrical transients which cannot be separated from the thermal signal), coupled with mounting variability not fairly attributable to the device itself being tested (but is rather due to differences in test board characteristics, solder thickness variation, etc.). When a limited range of the data is believed to accurately represent device-only dependence, a useful, simple, yet rigorous method has been developed to allow the analyst to minimize the scatter in the data set, while preserving the average value in the specified range. Application of this method to actual data is presented for purposes of illustration, and additional implications in the use of the method are discussed. Although this method was developed and is applied here in the context of thermal transient characterization, it is universal in potential application; the underlying mathematical "theorem" is completely general.
Sponsorship	Components, Packaging, & Manuf. Technol. Soc. IEEE (CPMT/IEEE) K-16 Committee on Electron. Cooling, Heat Transfer Div. ASME Electron. & Photonics & Packaging Div. (EPPD), ASME Int. Microelectron. & Packaging Soc. (IMAPS)
Starting Page	157
Ending Page	164
File Size	745264
Page Count	8
File Format	PDF
ISBN	0780371526
ISSN	10899870
DOI	10.1109/ITHERM.2002.1012452
Language	English
Publisher	Institute of Electrical and Electronics Engineers, Inc. (IEEE)
Publisher Date	2002-05-30
Publisher Place	USA
Access Restriction	Subscribed
Rights Holder	Institute of Electrical and Electronics Engineers, Inc. (IEEE)
Subject Keyword	Scattering Thermal resistance Electrical resistance measurement Cooling Semiconductor device packaging Testing Temperature distribution Power measurement Steady-state Semiconductor devices
Content Type	Text
Resource Type	Article

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