NDLI: Prediction of effect of heat sink adhesive on mechanical reliability of a wire bonded plastic ball grid array package

Content Provider	IEEE Xplore Digital Library
Author	Kaisare, A. Zhenxue Han Agonager, D. Ramakrishna, K.
Copyright Year	2002
Description	Author affiliation: Mech. & Aerosp. Eng. Dept., Texas Univ., Arlington, TX, USA (Kaisare, A.; Zhenxue Han; Agonager, D.)
Abstract	Stress analysis of a two-layer wire bonded plastic ball grid array (WB-PBGA) package has been carried out to study the effect of adhesively bonded heat sink. A three dimensional finite element model of the WB-PBGA package and the printed wiring board (PWB) is solved numerically to predict the stresses induced and assess their impact on the mechanical integrity of the die and package during cool-down of the assembly after adhesive cure. Stresses induced in the assembly have been computed for a wide range of values. of the heat sink adhesive mechanical properties and adhesive Young's modulus. Adhesive Young's modulus is in the range 0.7 to 34.5 GPa, and its coefficient of thermal expansion (CTE) is in the range 3 to 150 ppm/K covering most common adhesives, epoxies filled and unfilled and also eutectic lead-tin solder. From the results of the analyses stresses in the die and heat sink adhesive have been evaluated for cohesive failure of these components. Variation of interfacial peel and shear stresses at the interface between the mold compound and the adhesive and between the adhesive and the heat sink have also been examined.
Sponsorship	Components, Packaging, & Manuf. Technol. Soc. IEEE (CPMT/IEEE) K-16 Committee on Electron. Cooling, Heat Transfer Div. ASME Electron. & Photonics & Packaging Div. (EPPD), ASME Int. Microelectron. & Packaging Soc. (IMAPS)
Starting Page	926
Ending Page	931
File Size	437898
Page Count	6
File Format	PDF
ISBN	0780371526
ISSN	10899870
DOI	10.1109/ITHERM.2002.1012555
Language	English
Publisher	Institute of Electrical and Electronics Engineers, Inc. (IEEE)
Publisher Date	2002-05-30
Publisher Place	USA
Access Restriction	Subscribed
Rights Holder	Institute of Electrical and Electronics Engineers, Inc. (IEEE)
Subject Keyword	Heat sinks Wire Bonding Electronics packaging Plastic packaging Assembly Thermal stresses Finite element methods Predictive models Wiring
Content Type	Text
Resource Type	Article

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