NDLI: Thermal analyses of a PCM thermal control unit for portable electronic devices: experimental and numerical studies

Content Provider	IEEE Xplore Digital Library
Author	Alawadhi, E.M. Amon, C.H.
Copyright Year	2002
Description	Author affiliation: Dept. of Mech. Eng., Kuwait Univ., Safat, Kuwait (Alawadhi, E.M.)
Abstract	This paper investigates the effectiveness of a Thermal Control Unit (TCU) for portable electronic devices by performing experimental and numerical analyses. The TCU objective is to improve thermal management of electronic devices where their operating time is limited to few hours. It is composed of an organic Phase Change Material (PCM) and a Thermal Conductivity Enhancer (TCE). The TCU can provide a reliable solution to portable electronic devices, which avoids overheating and thermally-induced fatigue, as well as a solution which satisfies the ergonomic requirement. Since the thermal conductivity of the PCM is very low, a TCE is incorporated into the PCM to boost its conductivity. The TCU structure is complex, and modeling an electronic device with it requires time and effort. Hence, this research develops approximate, yet effective, solutions for the TCU. The TCU component properties are averaged and a single TCU material is considered. This approach is evaluated by comparing the numerical predictions with the experimental results. The numerical model is used to study the effect of some important parameters that are experimentally expensive to examine, such as the heat transfer coefficient, the PCM latent heat, the Stefan number, and the effect of the heat source power.
Sponsorship	Components, Packaging, & Manuf. Technol. Soc. IEEE (CPMT/IEEE) K-16 Committee on Electron. Cooling, Heat Transfer Div. ASME Electron. & Photonics & Packaging Div. (EPPD), ASME Int. Microelectron. & Packaging Soc. (IMAPS)
Starting Page	466
Ending Page	475
File Size	1090277
Page Count	10
File Format	PDF
ISBN	0780371526
ISSN	10899870
DOI	10.1109/ITHERM.2002.1012493
Language	English
Publisher	Institute of Electrical and Electronics Engineers, Inc. (IEEE)
Publisher Date	2002-05-30
Publisher Place	USA
Access Restriction	Subscribed
Rights Holder	Institute of Electrical and Electronics Engineers, Inc. (IEEE)
Subject Keyword	Phase change materials Thermal conductivity Heat transfer Thermal management of electronics Numerical analysis Thermal management Fatigue Ergonomics Conducting materials Numerical models
Content Type	Text
Resource Type	Article

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