NDLI: Computer modelling of the reliability of flip chips with metal column bumping

Content Provider	IEEE Xplore Digital Library
Author	Lu, H. Bailey, C.
Copyright Year	2002
Description	Author affiliation: Sch. of Comput. & Math. Sci., Greenwich Univ., London, UK (Lu, H.; Bailey, C.)
Abstract	Recently, research has been carried out to test a novel bumping method which omits the under bump metallurgy forming process by bonding copper columns directly onto the Al pads of the silicon dies. This bumping method could be adopted to simplify the flip chip manufacturing process, increase the productivity and achieve a higher I/O count. This paper describes an investigation of the solder joint reliability of flip-chips based on this new bumping process. Computer modelling methods are used to predict the shape of solder joints and response of flip chips to thermal cyclic loading. The accumulated plastic strain energy at the comer solder joints is used as the damage indicator. Models with a range of design parameters have been compared for their reliability. The parameters that have been investigated are the copper column height, radius and solder volume. The ranking of the relative importance of these parameters is given. For most of the results presented in the paper, the solder material has been assumed to be the lead-free 96.5Sn3.5Ag alloy but some results for 60Sn40Pb solder joints have also been presented.
Sponsorship	Components, Packaging, & Manuf. Technol. Soc. IEEE (CPMT/IEEE) K-16 Committee on Electron. Cooling, Heat Transfer Div. ASME Electron. & Photonics & Packaging Div. (EPPD), ASME Int. Microelectron. & Packaging Soc. (IMAPS)
Starting Page	967
Ending Page	973
File Size	741494
Page Count	7
File Format	PDF
ISBN	0780371526
ISSN	10899870
DOI	10.1109/ITHERM.2002.1012561
Language	English
Publisher	Institute of Electrical and Electronics Engineers, Inc. (IEEE)
Publisher Date	2002-05-30
Publisher Place	USA
Access Restriction	Subscribed
Rights Holder	Institute of Electrical and Electronics Engineers, Inc. (IEEE)
Subject Keyword	Flip chip Soldering Copper Testing Bonding Silicon Manufacturing processes Productivity Predictive models Shape
Content Type	Text
Resource Type	Article

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