NDLI: Thermal/fluid performance evaluation of serrated plate fin heat sinks

Content Provider	IEEE Xplore Digital Library
Author	Shwaish, I.K. Amon, C.H. Murthy, J.Y.
Copyright Year	2002
Description	Author affiliation: Dept. of Mech. Eng., Carnegie Mellon Univ., Pittsburgh, PA, USA (Shwaish, I.K.; Amon, C.H.)
Abstract	Cooling of the electronics in people movers and other rail transportation systems require the removal of high power dissipation from the electronic equipment to ensure their long term reliability and performance. In this study, the thermal performance of in-service serrated plate fin heat sink is evaluated for a range of Reynolds number by means of fully three-dimensional numerical simulations of the air flow over the heat sink. The flow is considered to be turbulent and both hydrodynamically and thermally developing. Our computations yield local and global heat transfer and flow parameters such as temperature distribution in the fin, heat transfer coefficient, Nusselt number, pressure drop, and the maximum temperature of the heat sink. The results point to the directions for optimizing the heat sink performance. Hence, variations of design parameters around the existing configurations are investigated. These parameters are fin interruption and staggering, fin height, serration spacing, fin thickness and inter-fin spacing, fin base thickness, and clearance gap between the fin tips and the upper wall of the channel that encloses the heat sink. The computations yield the optimal designs of plate fin heat sinks for transportation applications.
Sponsorship	Components, Packaging, & Manuf. Technol. Soc. IEEE (CPMT/IEEE) K-16 Committee on Electron. Cooling, Heat Transfer Div. ASME Electron. & Photonics & Packaging Div. (EPPD), ASME Int. Microelectron. & Packaging Soc. (IMAPS)
Starting Page	267
Ending Page	275
File Size	878372
Page Count	9
File Format	PDF
ISBN	0780371526
ISSN	10899870
DOI	10.1109/ITHERM.2002.1012467
Language	English
Publisher	Institute of Electrical and Electronics Engineers, Inc. (IEEE)
Publisher Date	2002-05-30
Publisher Place	USA
Access Restriction	Subscribed
Rights Holder	Institute of Electrical and Electronics Engineers, Inc. (IEEE)
Subject Keyword	Heat sinks Heat transfer Power system reliability Temperature distribution Electronics cooling Rail transportation Power dissipation Electronic equipment Numerical simulation Distributed computing
Content Type	Text
Resource Type	Article

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