NDLI: Vibration-induced droplet atomization heat transfer cell for high-heat flux applications

Content Provider	IEEE Xplore Digital Library
Author	Heffington, S.N. Black, W.Z. Glezer, A.
Copyright Year	2002
Description	Author affiliation: George W. Woodruff Sch. of Mech. Eng., Georgia Inst. of Technol., Atlanta, GA, USA (Heffington, S.N.; Black, W.Z.; Glezer, A.)
Abstract	This paper describes a unique two-phase cooling method that includes a closed heat transfer cell, similar to a thermosyphon that can be used to cool microelectronic packages. The cooling method is based upon a Vibration-Induced Droplet Atomization, or VIDA, process that can generate small liquid droplets inside a closed cell and propel them onto a heated surface. The VIDA technique involves the violent break-up of a liquid film into a shower of droplets by vibrating a piezoelectric actuator and accelerating the liquid film at resonant conditions. The droplets continually coat the surface with a thin liquid film, which evaporates on the heated surface, and the vapor is condensed on the internal surfaces of the heat transfer cell as well as the liquid working fluid. The condensed liquid is returned via gravity to the piezoelectric actuator where it is again atomized. A VIDA heat transfer cell 50 mm in diameter and 20 mm thick was constructed. Test data described in this study include the heat transfer characteristics and cooling capabilities for a small-scale cell that is suitable for cooling a desktop microprocessor during the burn-in portion of the manufacturing process. The VIDA process produces droplets of relatively uniform diameter, and the droplets have sufficient momentum to reach the remotely located heated source. Heat fluxes as high as 200 W/cm/sup 2/ have been measured when a chilled water heat exchanger is used as the external heat removal device.
Sponsorship	Components, Packaging, & Manuf. Technol. Soc. IEEE (CPMT/IEEE) K-16 Committee on Electron. Cooling, Heat Transfer Div. ASME Electron. & Photonics & Packaging Div. (EPPD), ASME Int. Microelectron. & Packaging Soc. (IMAPS)
Starting Page	408
Ending Page	412
File Size	603270
Page Count	5
File Format	PDF
ISBN	0780371526
ISSN	10899870
DOI	10.1109/ITHERM.2002.1012485
Language	English
Publisher	Institute of Electrical and Electronics Engineers, Inc. (IEEE)
Publisher Date	2002-05-30
Publisher Place	USA
Access Restriction	Subscribed
Rights Holder	Institute of Electrical and Electronics Engineers, Inc. (IEEE)
Subject Keyword	Heat transfer Cooling Water heating Piezoelectric films Piezoelectric actuators Microelectronics Packaging Propulsion Acceleration Resonance
Content Type	Text
Resource Type	Article

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4	Project PI / Joint PI	Principal Investigator and Joint Principal Investigators of the project	Dr. B. Sutradhar bsutra@ndl.gov.in Prof. Saswat Chakrabarti will be added soon
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