NDLI: Design, fabrication and testing of thermal components and their integration into a microfluidic device

Content Provider	IEEE Xplore Digital Library
Author	Smekal, T. Rhine, D. Weston, D. Grodzinski, P.
Copyright Year	2002
Description	Author affiliation: Microfluidics Lab., Motorola Labs., USA (Smekal, T.; Rhine, D.; Weston, D.; Grodzinski, P.)
Abstract	We discuss the design, integration and testing of thermal components in a microfluidic device designed for on-chip genetic sample preparation. A typical microdevice must perform several operations to be capable of analyzing a sample of body fluid (blood, urine, saliva), extracting DNA from concentrated cells, hybridization, purifying and amplifying DNA, and finally detecting DNA fragments of interest. Reduction of the sample volume down to a few /spl mu/Ls and improvement of the ramp times between temperature steps makes micro-PCR devices desirable. Thermal components such as heaters and resistive thermal devices (RTDs) are fabricated as an integral part of a complete genetic sample preparation micro-system. The ability to precisely control the temperature is a critical component of most microfluidic devices intended for on-chip genetic sample preparation Devices were fabricated and demonstrated a temperature variation of /spl sim/1/spl deg/C over the entire sample volume. The design of a device, including chamber dimensions, and placement of the heating and cooling elements is presented. The results of temperature cycling experiments are shown. We have measured a heating rate of /spl sim/2.4/spl deg/C/s and a cooling rate of /spl sim/2.0/spl deg/C/s for devices tested under active heating/cooling control. A brief overview of relevant microfabrication methods is also presented.
Sponsorship	Components, Packaging, & Manuf. Technol. Soc. IEEE (CPMT/IEEE) K-16 Committee on Electron. Cooling, Heat Transfer Div. ASME Electron. & Photonics & Packaging Div. (EPPD), ASME Int. Microelectron. & Packaging Soc. (IMAPS)
Starting Page	1039
Ending Page	1045
File Size	847949
Page Count	7
File Format	PDF
ISBN	0780371526
ISSN	10899870
DOI	10.1109/ITHERM.2002.1012572
Language	English
Publisher	Institute of Electrical and Electronics Engineers, Inc. (IEEE)
Publisher Date	2002-05-30
Publisher Place	USA
Access Restriction	Subscribed
Rights Holder	Institute of Electrical and Electronics Engineers, Inc. (IEEE)
Subject Keyword	Fabrication Testing Microfluidics Genetics DNA Heating Cooling Thermal resistance Temperature control Performance analysis
Content Type	Text
Resource Type	Article

Sl.	Authority	Responsibilities	Communication Details
1	Ministry of Education (GoI), Department of Higher Education	Sanctioning Authority	https://www.education.gov.in/ict-initiatives
2	Indian Institute of Technology Kharagpur	Host Institute of the Project: The host institute of the project is responsible for providing infrastructure support and hosting the project	https://www.iitkgp.ac.in
3	National Digital Library of India Office, Indian Institute of Technology Kharagpur	The administrative and infrastructural headquarters of the project	Dr. B. Sutradhar bsutra@ndl.gov.in
4	Project PI / Joint PI	Principal Investigator and Joint Principal Investigators of the project	Dr. B. Sutradhar bsutra@ndl.gov.in Prof. Saswat Chakrabarti will be added soon
5	Website/Portal (Helpdesk)	Queries regarding NDLI and its services	support@ndl.gov.in
6	Contents and Copyright Issues	Queries related to content curation and copyright issues	content@ndl.gov.in
7	National Digital Library of India Club (NDLI Club)	Queries related to NDLI Club formation, support, user awareness program, seminar/symposium, collaboration, social media, promotion, and outreach	clubsupport@ndl.gov.in
8	Digital Preservation Centre (DPC)	Assistance with digitizing and archiving copyright-free printed books	dpc@ndl.gov.in
9	IDR Setup or Support	Queries related to establishment and support of Institutional Digital Repository (IDR) and IDR workshops	idr@ndl.gov.in

Enhancement in CMOS chip performance through microfluidic cooling

Thermal Modeling for Design Optimization of a Microfluidic Device for Continuous Flow Polymerase Chain Reaction (PCR)

Optimal heat transfer performance of the microfluidic electrospray cooling devices

Integrated Microfluidic Cooling and Interconnects for 2D and 3D Chips

The Dynamic Inverse Method for Thermal Resistance of Cooling Device

Thermal Analysis of a Novel Continuous Flow Multi Layered Polymerase Chain Reaction Device

CMOS microfluidic fabrication technology for biomedical applications

Spiral Microfluidics Device for Continuous Flow PCR

Design and fabrication of micro heat flux sensor

Design, fabrication and testing of thermal components and their integration into a microfluidic device

Similar Documents

Enhancement in CMOS chip performance through microfluidic cooling

Thermal Modeling for Design Optimization of a Microfluidic Device for Continuous Flow Polymerase Chain Reaction (PCR)

Optimal heat transfer performance of the microfluidic electrospray cooling devices

Integrated Microfluidic Cooling and Interconnects for 2D and 3D Chips

The Dynamic Inverse Method for Thermal Resistance of Cooling Device

Thermal Analysis of a Novel Continuous Flow Multi Layered Polymerase Chain Reaction Device

CMOS microfluidic fabrication technology for biomedical applications

Spiral Microfluidics Device for Continuous Flow PCR

Design and fabrication of micro heat flux sensor

Design, fabrication and testing of thermal components and their integration into a microfluidic device