NDLI: Miniature vapor compression refrigeration systems for active cooling of high performance computers

Content Provider	IEEE Xplore Digital Library
Author	Heydari, A.
Copyright Year	2002
Description	Author affiliation: Sun Microsystems, Palo Alto, CA, USA (Heydari, A.)
Abstract	A small refrigeration system for cooling of computer system components is evaluated. A thermodynamic model describing the performance of the cycle along with a computer simulation program is developed to evaluate its performance. The refrigeration system makes use of a miniature reciprocating vapor compression compressor. Due to space limitations in some high performance computer servers, a miniature refrigeration system composed of a compressor, capillary tube, a compact condenser, and a cold-plate evaporator heat exchanger are used. Mathematical multi-zone formulation for modeling thermal-hydraulic performance of heat exchanger for the condenser and evaporator are presented. The throttling device is a capillary tube and there is presented a mathematical formulation for predicting refrigerant mass flow rate through the throttling device. A physically based efficiency formulation for simulating the performance of the miniature compressor is used. An efficient iterative numerical scheme with allowance for utilization of various refrigerants is developed to solve the governing system of equations. Using the simulation program, the effects of parameters such as the choice of working refrigerant, evaporating and condensing temperatures on system components and overall efficiency of system are studied. In addition, a RAS (reliability, availability and serviceability) discussion of the proposed CPU-cooling refrigeration solution is presented. The results of analysis show that the new technology not only overcomes many shortcomings of the traditional fan-cooled systems, but also has the capacity of increasing the cooling system's coefficient of performance.
Sponsorship	Components, Packaging, & Manuf. Technol. Soc. IEEE (CPMT/IEEE) K-16 Committee on Electron. Cooling, Heat Transfer Div. ASME Electron. & Photonics & Packaging Div. (EPPD), ASME Int. Microelectron. & Packaging Soc. (IMAPS)
Starting Page	371
Ending Page	378
File Size	837826
Page Count	8
File Format	PDF
ISBN	0780371526
ISSN	10899870
DOI	10.1109/ITHERM.2002.1012480
Language	English
Publisher	Institute of Electrical and Electronics Engineers, Inc. (IEEE)
Publisher Date	2002-05-30
Publisher Place	USA
Access Restriction	Subscribed
Rights Holder	Institute of Electrical and Electronics Engineers, Inc. (IEEE)
Subject Keyword	Refrigeration Cooling High performance computing Refrigerants Space heating Thermodynamics Computer simulation Mathematical model Equations Temperature
Content Type	Text
Resource Type	Article

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