NDLI: Local thermal management for space-borne inflatable RF antennas

Content Provider	IEEE Xplore Digital Library
Author	Celis, M.A. Lien, K.T. Brown, E.R. Huang, J. Edelstein, W.
Copyright Year	2002
Description	Author affiliation: Dept. of Electr. Eng., California Univ., Los Angeles, CA, USA (Celis, M.A.; Lien, K.T.; Brown, E.R.)
Abstract	With the space shuttle payload cost at approximately $10 K per pound, emphasis is being placed on reducing the weight of space-based systems. NASA is presently developing lightweight RF components such as inflatable antennas. We have investigated one key issue of the inflatable antenna: thermal management of the RF electronics. Our approach, called local thermal management (LTM), is a technique of heat removal based on the dual use of the RF ground-plane layer of the antenna, which consists of a copper film with Kapton cladding on one side and an emissive IR material on the other. The copper reflects the RF antenna pattern and also spreads and transfers the heat to the IR emissive layer. Our LTM concept was investigated for a radar application at 1.25 GHz (L band) in which the dissipated power of the RF electronics is 1.2 W. Experiments were conducted in vacuum (3 /spl times/ 10/sup -6/ torr) on a unit cell of the antenna where a resistor was bonded and biased for 2 W heat dissipation. The experimental data was then used to calibrate an Icepak/spl trade/ 4.0 numerical simulation of an inflatable antenna cell in the low earth orbit (LEO) environment, taking into account the thermal fluxes from the earth and sun. The simulation predicted a junction temperature of 122/spl deg/C well within the range of safe electronics operation.
Sponsorship	Components, Packaging, & Manuf. Technol. Soc. IEEE (CPMT/IEEE) K-16 Committee on Electron. Cooling, Heat Transfer Div. ASME Electron. & Photonics & Packaging Div. (EPPD), ASME Int. Microelectron. & Packaging Soc. (IMAPS)
Starting Page	1015
Ending Page	1019
File Size	531112
Page Count	5
File Format	PDF
ISBN	0780371526
ISSN	10899870
DOI	10.1109/ITHERM.2002.1012568
Language	English
Publisher	Institute of Electrical and Electronics Engineers, Inc. (IEEE)
Publisher Date	2002-05-30
Publisher Place	USA
Access Restriction	Subscribed
Rights Holder	Institute of Electrical and Electronics Engineers, Inc. (IEEE)
Subject Keyword	Thermal management Radio frequency Thermal management of electronics Copper Low earth orbit satellites Spaceborne radar Space shuttles Payloads Costs NASA
Content Type	Text
Resource Type	Article

Sl.	Authority	Responsibilities	Communication Details
1	Ministry of Education (GoI), Department of Higher Education	Sanctioning Authority	https://www.education.gov.in/ict-initiatives
2	Indian Institute of Technology Kharagpur	Host Institute of the Project: The host institute of the project is responsible for providing infrastructure support and hosting the project	https://www.iitkgp.ac.in
3	National Digital Library of India Office, Indian Institute of Technology Kharagpur	The administrative and infrastructural headquarters of the project	Dr. B. Sutradhar bsutra@ndl.gov.in
4	Project PI / Joint PI	Principal Investigator and Joint Principal Investigators of the project	Dr. B. Sutradhar bsutra@ndl.gov.in Prof. Saswat Chakrabarti will be added soon
5	Website/Portal (Helpdesk)	Queries regarding NDLI and its services	support@ndl.gov.in
6	Contents and Copyright Issues	Queries related to content curation and copyright issues	content@ndl.gov.in
7	National Digital Library of India Club (NDLI Club)	Queries related to NDLI Club formation, support, user awareness program, seminar/symposium, collaboration, social media, promotion, and outreach	clubsupport@ndl.gov.in
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9	IDR Setup or Support	Queries related to establishment and support of Institutional Digital Repository (IDR) and IDR workshops	idr@ndl.gov.in

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