NDLI: Electronics packaging/interconnect: the next crisis

Content Provider	IEEE Xplore Digital Library
Author	Kurtz, B.E.
Copyright Year	1990
Description	Author affiliation: Allied-Signal Inc., Morristown, NJ, USA (Kurtz, B.E.)
Abstract	A study of the effect of changes in electronics packaging/interconnect (P/I) technology on military electronics is reported. The study was initiated after observing that the performance potential represented by advances in semiconductors has not been realized on the system level due to limitations imposed by P/I technology. It was also noted that packaging/interconnect is the primary source of reliability problems and the single biggest contributor to manufacturing cost. The 1991 state of packaging/interconnect technology (as used in both military and nonmilitary electronics) was examined and projections made to the year 2000. It was concluded that inserting P/I technologies developed for automotive, commercial, and consumer electronics into military applications is essential to attaining necessary cost-performance objectives for military electronics of the year 2000 and that this process will result in significant dislocations within the traditional military-electronics community. Actions to ensure the survival of an indigenous military-electronics capability are recommended.<>
Starting Page	2112
Ending Page	2115
File Size	524660
Page Count	4
File Format	PDF
DOI	10.1109/ISCAS.1990.112221
Language	English
Publisher	Institute of Electrical and Electronics Engineers, Inc. (IEEE)
Publisher Date	1990-05-01
Publisher Place	USA
Access Restriction	Subscribed
Rights Holder	Institute of Electrical and Electronics Engineers, Inc. (IEEE)
Subject Keyword	Electronics packaging Integrated circuit interconnections Power system interconnection Costs Semiconductor device packaging Assembly National security Defense industry Electronics industry Automatic testing
Content Type	Text
Resource Type	Article

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