NDLI: Integrated Microfluidic Cooling and Interconnects for 2D and 3D Chips

Content Provider	IEEE Xplore Digital Library
Author	Bing Dang Bakir, M.S. Sekar, D.C. King, C.R. Meindl, J.D.
Copyright Year	1999
Abstract	Power dissipation in microprocessors is projected to reach a level that may necessitate chip-level liquid cooling in the near future. An on-chip microchannel heat sink can reduce the total thermal interfaces between an integrated circuit chip and the convective cooling medium and therefore yield smaller junction-to-ambient thermal resistance. This paper reports the fabrication, assembly, and testing of a silicon chip with complementary metal-oxide-semiconductor process compatible microchannel heat sink and thermofluidic chip input/output (I/O) interconnects fabricated using wafer-level batch processing. Ultra-small form factor, low-cost fabrication and assembly (system integration) are achieved for 2D and 3D chips, as the microchannel heat sink is fabricated directly on back-side of each chip. Through-wafer electrical and fluidic vias are used to interconnect the monolithically integrated microchannel heat sink to thermofluidic chip I/O interconnections. The feasibility of the novel fluidic I/O interconnect is demonstrated through preliminary thermal resistance measurements.
Sponsorship	IEEE Components, Packaging, and Manufacturing Technology Society IEEE Components, Packaging and Manufacturing Technology Society
Starting Page	79
Ending Page	87
Page Count	9
File Size	1717446
File Format	PDF
ISSN	15213323
Volume Number	33
Issue Number	1
Language	English
Publisher	Institute of Electrical and Electronics Engineers, Inc. (IEEE)
Publisher Date	2010-02-01
Publisher Place	U.S.A.
Access Restriction	Subscribed
Rights Holder	Institute of Electrical and Electronics Engineers, Inc. (IEEE)
Subject Keyword	Microfluidics Cooling Integrated circuit interconnections Microchannel Heat sinks Thermal resistance Resistance heating Fabrication Power dissipation Microprocessors 3D integration Assembly fluidic input/output (I/O) interconnect microchannel heat sink microfluidic cooling packaging stacking thermal management
Content Type	Text
Resource Type	Article
Subject	Electrical and Electronic Engineering

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