NDLI: A bead probe CAD strategy for in-circuit test

Content Provider	IEEE Xplore Digital Library
Author	Parker, K.P. DeMille, D.
Copyright Year	2007
Description	Author affiliation: Agilent Technol., Loveland, CO (Parker, K.P.)
Abstract	Bead Probe Technology has been developed as alternative In-Circuit Test (ICT) contact points replacing conventional test pads normally integrated into a printed circuit layout [Park04], [Park05], [DoGr06], [Agil07]. This paper discusses the potential of using Bead Probes in Computer Aided Design (CAD) systems when getting a board ready for production. It outlines the requirements that a software package must address in order to incorporate Bead Probes into the board design process. Finally, a software package was developed to implement this process and evaluations were made on a number of circuit boards representing the industry sectors of communications, consumer electronics, military/aerospace and automotive. The evaluations provide insight into the ability of Bead Probes to enhance access, manage board stress, reduce cost and increase ICT test reliability.
Starting Page	1
Ending Page	8
File Size	468340
Page Count	8
File Format	PDF
ISBN	9781424411276
ISSN	10893539
DOI	10.1109/TEST.2007.4437600
Language	English
Publisher	Institute of Electrical and Electronics Engineers, Inc. (IEEE)
Publisher Date	2007-10-21
Publisher Place	USA
Access Restriction	Subscribed
Rights Holder	Institute of Electrical and Electronics Engineers, Inc. (IEEE)
Subject Keyword	Probes Circuit testing Design automation Printed circuits Software packages Aerospace industry Integrated circuit technology Production systems Process design Communication industry
Content Type	Text
Resource Type	Article
Subject	Applied Mathematics Electrical and Electronic Engineering

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