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| Content Provider | IEEE Xplore Digital Library |
|---|---|
| Author | Gyeonghoon Kim Youchang Kim Kyuho Lee Seongwook Park Injoon Hong Kyeongryeol Bong Dongjoo Shin Sungpill Choi Jinwook Oh Hoi-Jun Yoo |
| Copyright Year | 2014 |
| Description | Author affiliation: KAIST, Daejeon, South Korea (Gyeonghoon Kim; Youchang Kim; Kyuho Lee; Seongwook Park; Injoon Hong; Kyeongryeol Bong; Dongjoo Shin; Sungpill Choi; Jinwook Oh; Hoi-Jun Yoo) |
| Abstract | Augmented reality (AR) is being investigated in advanced displays for the augmentation of images in a real-world environment. Wearable systems, such as head-mounted display (HMD) systems, have attempted to support real-time AR as a next generation UI/UX [1-2], but have failed, due to their limited computing power. In a prior work, a chip with limited AR functionality was reported that could perform AR with the help of markers placed in the environment (usually 1D or 2D bar codes) [3]. However, for a seamless visual experience, 3D objects should be rendered directly on the natural video image without any markers. Unlike marker-based AR, markerless AR requires natural feature extraction, general object recognition, 3D reconstruction, and camera-pose estimation to be performed in parallel. For instance, markerless AR for a VGA input-test video consumes ~1.3W power at 0.2fps throughput, with TI's OMAP4430, which exceeds power limits for wearable devices. Consequently, there is a need for a high-performance energy-efficient markerless AR processor to realize a real-time AR system, especially for HMD applications. |
| Starting Page | 182 |
| Ending Page | 183 |
| File Size | 19360110 |
| Page Count | 2 |
| File Format | |
| ISBN | 9781479909186 |
| ISSN | 01936530 |
| e-ISBN | 9781479909209 |
| DOI | 10.1109/ISSCC.2014.6757391 |
| Language | English |
| Publisher | Institute of Electrical and Electronics Engineers, Inc. (IEEE) |
| Publisher Date | 2014-02-09 |
| Publisher Place | USA |
| Access Restriction | Subscribed |
| Rights Holder | Institute of Electrical and Electronics Engineers, Inc. (IEEE) |
| Subject Keyword | Augmented reality Throughput Engines Multicore processing Neural networks Real-time systems Three-dimensional displays |
| Content Type | Text |
| Resource Type | Article |
| Subject | Electronic, Optical and Magnetic Materials Electrical and Electronic Engineering |
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