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| Content Provider | IEEE Xplore Digital Library |
|---|---|
| Author | Iuchi, T. Gogami, A. |
| Copyright Year | 2009 |
| Description | Author affiliation: Department of Mechanical Engineering, Toyo University, Saitama, Japan (Iuchi, T.) || School of Engineering, Toyo University, Saitama, Japan (Gogami, A.) |
| Abstract | The emissivity behavior of a silicon wafer is simulated using a simple modeling of the spectral, directional and polarization characteristics of thermal radiation. This study reveals that the p-polarized spectral emissivity of the silicon wafer at a specified direction remains constant. Then, subsequent experiments confirmed the simulated results that the p-polarized emissivity of silicon wafers is maintained to be 0.83 at an angle of 55.4° and a wavelength of 0.9 µm in spite of wide variations in oxide film thickness from 0 to 950 nm, temperature over 900 K as well as resistivity from 0.01 to 2000 Ωcm relevant to impurity concentrations doped into the silicon wafer. The overall extended uncertainty (k =2) of the temperature measurement is estimated to be 3.82 K over 900 K at the moment. This result is expected to enable significantly more accurate in situ radiation thermometry of silicon wafers in real manufacturing processes. |
| Starting Page | 2806 |
| Ending Page | 2811 |
| File Size | 797192 |
| Page Count | 6 |
| File Format | |
| ISBN | 9784907764340 |
| Language | English |
| Publisher | Institute of Electrical and Electronics Engineers, Inc. (IEEE) |
| Publisher Date | 2009-08-18 |
| Publisher Place | Japan |
| Access Restriction | Subscribed |
| Rights Holder | SICE |
| Subject Keyword | Silicon Polarization Semiconductor device modeling Semiconductor process modeling Semiconductor films Temperature measurement Manufacturing processes Optical films Conductivity Impurities polarization emissivity silicon wafer |
| Content Type | Text |
| Resource Type | Article |
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