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| Content Provider | IEEE Xplore Digital Library |
|---|---|
| Author | Marion, F. Lasfargues, G. Ribot, H. Largeron, C. Adelmini, L. Marmonier, F. |
| Copyright Year | 2007 |
| Description | Author affiliation: MINATEC, Grenoble (Marion, F.; Lasfargues, G.; Ribot, H.; Largeron, C.; Adelmini, L.; Marmonier, F.) |
| Abstract | Hybridization of heterogeneous components using flip chip technology is a key process for the assembly of large focal plane array (FPA) used in imaging systems. Since these systems are usually submitted to large thermal excursion, even in normal operation, substantial stress is induced in the interconnection layer, especially near the edge of the FPA. Such stress can result in cracks or delamination and jeopardize reliability. This work describes an innovative device and its associated process "AMIS" (stands for French AMinci, ISole) that: (a) decreases stress induced in the interconnection bumps. (b) Reduces serial access resistance to the pixel. (c) Reduces optical cross coupling between pixels. In this study, we demonstrate the feasibility of such hybrid heterogeneous systems and evaluate their mechanical robustness when submitted to severe thermal cycling. |
| Starting Page | 631 |
| Ending Page | 635 |
| File Size | 1159918 |
| Page Count | 5 |
| File Format | |
| ISBN | 9781424413249 |
| DOI | 10.1109/EPTC.2007.4469841 |
| Language | English |
| Publisher | Institute of Electrical and Electronics Engineers, Inc. (IEEE) |
| Publisher Date | 2007-12-10 |
| Publisher Place | Singapore |
| Access Restriction | Subscribed |
| Rights Holder | Institute of Electrical and Electronics Engineers, Inc. (IEEE) |
| Subject Keyword | Thermal stresses Optical imaging Flip chip Assembly systems Delamination Ambient intelligence Optical devices Optical interconnections Optical coupling Robustness |
| Content Type | Text |
| Resource Type | Article |
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