NDLI: Copper Deposition and Patterning for Glass Substrate Manufacture

Content Provider	IEEE Xplore Digital Library
Author	Xiaoyun Cui Bhatt, D. Hutt, D.A. Williams, K. Conway, P.P.
Copyright Year	2007
Description	Author affiliation: Loughborough Univ., Loughborough (Xiaoyun Cui; Bhatt, D.; Hutt, D.A.; Williams, K.; Conway, P.P.)
Abstract	Glass is a potential substrate material for the manufacture of substrates for high density electrical and optical interconnect. However, in order to realize such substrates, metallization is required to form conductive tracks and pads. In this work, electroless copper was used due to its relatively low cost, fast speed and potential for high volume production. Silanisation of the glass surfaces with (3-aminopropyl) trimethoxysilane (APTS) was used to provide a surface-coupled layer of functional molecules to assist in the adhesion of Pd/Sn catalyst and the subsequent copper deposition. The composition and microstructure of the modified glass surfaces were characterized by X-ray photoelectron spectroscopy (XPS) and atomic force microscopy (AFM). Tape peel testing was used to qualitatively assess the adhesion of the copper to the smooth glass surface. For layers less than 150 nm thick, adhesion was good, but thicker coatings tended to peel away easily. Preliminary analysis of the peeled surfaces indicated that failure occurred at the interface between the copper and the catalyst. As an alternative approach for improving adhesion, laser machining was used to roughen the glass and direct the deposition of electroless copper, such that circuit patterns with good adhesion were formed.
Starting Page	37
Ending Page	42
File Size	1314659
Page Count	6
File Format	PDF
ISBN	9781424413249
DOI	10.1109/EPTC.2007.4469747
Language	English
Publisher	Institute of Electrical and Electronics Engineers, Inc. (IEEE)
Publisher Date	2007-12-10
Publisher Place	Singapore
Access Restriction	Subscribed
Rights Holder	Institute of Electrical and Electronics Engineers, Inc. (IEEE)
Subject Keyword	Copper Glass manufacturing Adhesives Atomic force microscopy Rough surfaces Surface roughness Conducting materials Optical materials Optical interconnections Metallization
Content Type	Text
Resource Type	Article

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