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| Content Provider | IEEE Xplore Digital Library |
|---|---|
| Author | Bin Xie Xunqing Shi Xuejun Fan |
| Copyright Year | 2007 |
| Description | Author affiliation: Shanghai Jiao Tong Univ., Shanghai (Bin Xie) |
| Abstract | The existing IPC/JEDEC of moisture/reflow sensitivity classification determines the time of accelerated equivalent soak by the equivalency of moisture concentration at the critical interface with the standard sensitivity test. This paper proposes a new methodology of accelerated moisture sensitivity test based on the equivalency of both local moisture concentration and overall moisture distribution for stacked-die molded matrix array package (MMAP). The new methodology can ensure the same failure rate of cracking/delamination by the equivalency of local vapor pressure, interfacial adhesion as well as the thermo- and hygro-stresses. Finite element analysis (FEA) is applied for moisture diffusion and vapor pressure analysis under the conditions of 30degC/60%RH and 60degC/60%RH, respectively. At 70 hours at 60degC/60%RH, both the local moisture concentration at critical interface and overall moisture distribution of package become identical with that at 216 at 30degC/60%RH, indicating that 70 hours is the equivalent soak time compared to the standard MSL-3 for this type of MMAP packages. Such an equivalency of the new accelerated test conditions is proven by moisture/reflow experiments under various soak times at 30degC/60%RH and 60degC/60%RH. Damage response assessed from inspection for internal cracking/delamination indicates that the accelerated test procedures are well correlated and considered indistinguishable in terms of failure rate. |
| Starting Page | 100 |
| Ending Page | 104 |
| File Size | 274434 |
| Page Count | 5 |
| File Format | |
| ISBN | 9781424413249 |
| DOI | 10.1109/EPTC.2007.4469765 |
| Language | English |
| Publisher | Institute of Electrical and Electronics Engineers, Inc. (IEEE) |
| Publisher Date | 2007-12-10 |
| Publisher Place | Singapore |
| Access Restriction | Subscribed |
| Rights Holder | Institute of Electrical and Electronics Engineers, Inc. (IEEE) |
| Subject Keyword | Life estimation Moisture Thermal stresses Electronic packaging thermal management Temperature sensors Delamination Humidity Electronic equipment testing Plastics Adhesives |
| Content Type | Text |
| Resource Type | Article |
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