NDLI: Reliability Evaluation for Power Electronics Device using Electrical Thermal and Mechanical Analysis

Content Provider	IEEE Xplore Digital Library
Author	Anzawa, T. Qiang Yu Shibutani, T. Shiratori, M.
Copyright Year	2007
Description	Author affiliation: Yokohama Nat. Univ., Yokohama (Anzawa, T.; Qiang Yu; Shibutani, T.; Shiratori, M.)
Abstract	For power electronics devices, the reliability of thermal fatigue induced by power cycling has been prioritized as an important concern. Since power cycling produces non-uniform temperature distribution in the device, coupled thermal- structure analysis is required to evaluate thermal fatigue mechanism. The thermal expansion difference between a package and a substrate causes thermal fatigue. Many studies on thermal fatigue in electronics devices have been reported but temperature is often assumed to be uniform under thermal cycling environment. In this study, thermal fatigue of solder joints on power electronics device was evaluated. Joule heating produces temperature distribution, which affects the behavior of thermal fatigue. The finite element method (FEM) was used to evaluate temperature distribution induced by joule heating. Higher temperature appears below the bonded wire because the electric current flow through the bonding wire. Coupled thermal-structure analysis was also performed to evaluate the inelastic strain distribution. The damage of each element can be calculated from equivalent inelastic strain range and crack propagation was simulated by deleting damaged elements step by step. The crack initiates below the bonded wire and propagates concentrically under power cycling. There is the difference from environmental thermal cycling where the crack initiates at the edge of solder.
Starting Page	94
Ending Page	99
File Size	3604168
Page Count	6
File Format	PDF
ISBN	9781424413249
DOI	10.1109/EPTC.2007.4469833
Language	English
Publisher	Institute of Electrical and Electronics Engineers, Inc. (IEEE)
Publisher Date	2007-12-10
Publisher Place	Singapore
Access Restriction	Subscribed
Rights Holder	Institute of Electrical and Electronics Engineers, Inc. (IEEE)
Subject Keyword	Power electronics Electronic packaging thermal management Fatigue Temperature distribution Bonding Wire Thermal expansion Heating Capacitive sensors Soldering
Content Type	Text
Resource Type	Article

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