NDLI: A numerical study of the effects of temperature, moisture and vapour pressure on delamination in a PQFP during solder reflow

Content Provider	IEEE Xplore Digital Library
Author	Hu Guojun Tay, A.A.O.
Copyright Year	2004
Description	Author affiliation: Dept. of Mech. Eng., Singapore Nat. Univ., Singapore (Hu Guojun; Tay, A.A.O.)
Abstract	Delamination during solder reflow is a critical reliability problem for the plastic IC packages. The main objective of this paper is to investigate the effects of temperature, moisture diffusion and vapour pressure on the likelihood of delamination of the interface between the leadframe pad and the encapsulant. In this paper the entire thermal and moisture history of a plastic IC package is simulated from the start of level 1 moisture preconditioning (85/spl deg/C/85%RH for 168 hours) to subsequent exposure to a solder reflow process lasting about 5 minutes. The transient development of the strain energy release rate due to thermal stress only G/sub t/, hygrostress only G/sub h/, vapour pressure G/sub p/ and combined G/sub tot/ are computed and studied by using a new modified crack surface displacement extrapolation method (MCSDEM). Finite element models were constructed for a 160-leaded PQFP. The initial crack length was varied from 0.1mm to 3.5mm in order to study its effect. The results show that for small cracks, the effects of temperature and moisture are dominant while that of vapour pressure is insignificant. For moderate crack lengths, the effect of temperature is greatest. For large crack lengths, the effect of vapour pressure is dominant.
Starting Page	98
Ending Page	104
File Size	365978
Page Count	7
File Format	PDF
ISBN	0780388216
DOI	10.1109/EPTC.2004.1396585
Language	English
Publisher	Institute of Electrical and Electronics Engineers, Inc. (IEEE)
Publisher Date	2004-12-08
Publisher Place	Singapore
Access Restriction	Subscribed
Rights Holder	Institute of Electrical and Electronics Engineers, Inc. (IEEE)
Subject Keyword	Temperature Moisture Delamination Plastic integrated circuit packaging Thermal stresses Lead History Integrated circuit modeling Capacitive sensors Surface cracks
Content Type	Text
Resource Type	Article

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