NDLI: Polymer embedded module for SiP application

Content Provider	IEEE Xplore Digital Library
Author	Seung Wook Yoon Andy, L.K.J. Ganesh, V.P. Kripesh, V.
Copyright Year	2004
Description	Author affiliation: Inst. of Microelectron., Singapore (Seung Wook Yoon)
Abstract	Systems in package (SiP) allow a greater density of silicon devices (IC) to be mounted directly onto a substrate within a single component package. Further miniaturization in microelectronics system requires 3D integration of active, passive or module components. In order to maintain signal integrity, approaches featuring much shorter, impedance-matched, and less-interconnect-level between chips and passive components are desired, leading to the functional integration. In order to realise miniaturized functional modules, embedding actives and passives is potential baseline. Wafer level integration enables low cost and mass manufacturability of micro modules. In this work, embedding a silicon chip into a wafer level cavity layer was attempted and presented. The polymer module process is investigated using a thick polymer photoresist to create a multi-layered 3D structure with microchip integration. SU-8 was used as the polymer thick layer to give the carrier structure for the embedding of silicon chip or device. SU-8 with its high aspect ratio capabilities and good photosensitivity, enabled to create a good base structure for embedding silicon chip. Experiments were carried out in the following stages to determine the feasibility of the process. Silicon substrate was coated with a thick SU-8 layer of 100mum and developed to form the base substrate. On this base silicon test chip were die-attached and a passivation dielectric layer was deposited and developed over the passivation layer UBM and metal layer were deposited for interconnection and bumping. The prototype samples with 3.5mmtimes3.5mm dies having 70mum thickness were successfully thinned. The embedded module was then coated with a dielectric and interconnection processes were followed. The test vehicles showed electrical connectivity and the embedded module technology can be further used in the field of advanced microelectronics or microsystem packaging. The solution to 3D wafer level integration whilst having smaller systems and components can also be achieved using this embedded module technology
Starting Page	600
Ending Page	604
File Size	423988
Page Count	5
File Format	PDF
ISBN	0780388216
DOI	10.1109/EPTC.2004.1396678
Language	English
Publisher	Institute of Electrical and Electronics Engineers, Inc. (IEEE)
Publisher Date	2004-12-08
Publisher Place	Singapore
Access Restriction	Subscribed
Rights Holder	Institute of Electrical and Electronics Engineers, Inc. (IEEE)
Subject Keyword	Polymers Dielectric substrates Integrated circuit packaging Microelectronics Testing Passivation Silicon devices Impedance Costs Manufacturing
Content Type	Text
Resource Type	Article

Sl.	Authority	Responsibilities	Communication Details
1	Ministry of Education (GoI), Department of Higher Education	Sanctioning Authority	https://www.education.gov.in/ict-initiatives
2	Indian Institute of Technology Kharagpur	Host Institute of the Project: The host institute of the project is responsible for providing infrastructure support and hosting the project	https://www.iitkgp.ac.in
3	National Digital Library of India Office, Indian Institute of Technology Kharagpur	The administrative and infrastructural headquarters of the project	Dr. B. Sutradhar bsutra@ndl.gov.in
4	Project PI / Joint PI	Principal Investigator and Joint Principal Investigators of the project	Dr. B. Sutradhar bsutra@ndl.gov.in Prof. Saswat Chakrabarti will be added soon
5	Website/Portal (Helpdesk)	Queries regarding NDLI and its services	support@ndl.gov.in
6	Contents and Copyright Issues	Queries related to content curation and copyright issues	content@ndl.gov.in
7	National Digital Library of India Club (NDLI Club)	Queries related to NDLI Club formation, support, user awareness program, seminar/symposium, collaboration, social media, promotion, and outreach	clubsupport@ndl.gov.in
8	Digital Preservation Centre (DPC)	Assistance with digitizing and archiving copyright-free printed books	dpc@ndl.gov.in
9	IDR Setup or Support	Queries related to establishment and support of Institutional Digital Repository (IDR) and IDR workshops	idr@ndl.gov.in

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