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| Content Provider | IEEE Xplore Digital Library |
|---|---|
| Author | Tay, A.A.O. Lin, T.Y. |
| Copyright Year | 1999 |
| Description | Author affiliation: Centre for IC failure Analysis & Reliability, Nat. Univ. of Singapore, Singapore (Tay, A.A.O.) |
| Abstract | During the solder reflow process moisture will diffuse out of plastic IC packages especially at the higher temperatures. This will tend to reduce the hygrostress and hence lower the tendency to popcorn cracking. However, the extent of this reduction is still unclear. The main objective of this paper is to determine the impact of this moisture diffusion during solder reflow on package reliability. In this paper the entire thermal and moisture history of a plastic IC package is simulated from the start of level 1 moisture preconditioning (85/spl deg/C/85%RH for 168 hours) to subsequent exposure to a solder reflow process lasting about 5 minutes. The transient development of the strain energy release rate due to thermal stress only, hygrostress only and combined hygrothermal stresses are computed and studied. Two numerical methods of computing stress intensity factors will be used and compared as to their merits. |
| Starting Page | 830 |
| Ending Page | 836 |
| File Size | 445742 |
| Page Count | 7 |
| File Format | |
| ISBN | 0780352319 |
| ISSN | 05695503 |
| DOI | 10.1109/ECTC.1999.776278 |
| Language | English |
| Publisher | Institute of Electrical and Electronics Engineers, Inc. (IEEE) |
| Publisher Date | 1999-06-01 |
| Publisher Place | USA |
| Access Restriction | Subscribed |
| Rights Holder | Institute of Electrical and Electronics Engineers, Inc. (IEEE) |
| Subject Keyword | Moisture Capacitive sensors Delamination Temperature Thermal stresses Plastic integrated circuit packaging Integrated circuit packaging Extrapolation Failure analysis Manufacturing processes |
| Content Type | Text |
| Resource Type | Article |
| Subject | Electronic, Optical and Magnetic Materials Electrical and Electronic Engineering |
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