NDLI: Effect of stress on interfacial intermetallic compound development of Sn-Ag-Cu lead-free solder joint on Au/Ni/Cu substrate

Content Provider	IEEE Xplore Digital Library
Author	Ngoh, S.L. Zhou, W. Pang, H.L. Spowage, A.C. Shi, X.Q.
Copyright Year	2004
Description	Author affiliation: Sch. of Mech. & Production Eng., Nanyang Technol. Univ., Singapore (Ngoh, S.L.; Zhou, W.; Pang, H.L.)
Abstract	The formation of thin intermetallic compounds (IMC) due to reaction between the solder and substrate during device fabrication is essential to achieve a good metallurgical bond. Nevertheless, excessive IMC growth significantly decreases the reliability of the solder joint. The thickness of IMC is influenced by numerous factors during the component fabrication process and in service. Stress is known to be an important factor, but no existing method can be used to study the effect of stress state on IMC growth. This work presents a novel method to study the effect of stress on interface IMC layer growth of Sn-Ag-Cu lead-free solder on the Cu substrate coated with electroless Ni and immersion Au (ENIG). In this technique, C-ring is used and in-plane bending induced tensile and compressive stresses can be applied by tightening the C-ring. Isothermal annealing experiments at 125 /spl deg/C and at different levels of induced bending stresses on the C-ring were investigated The effect of in-plane tensile and in-plane compressive stresses on IMC growth are quantified.
Starting Page	414
Ending Page	419
File Size	565183
Page Count	6
File Format	PDF
ISBN	0780388216
DOI	10.1109/EPTC.2004.1396644
Language	English
Publisher	Institute of Electrical and Electronics Engineers, Inc. (IEEE)
Publisher Date	2004-12-08
Publisher Place	Singapore
Access Restriction	Subscribed
Rights Holder	Institute of Electrical and Electronics Engineers, Inc. (IEEE)
Subject Keyword	Intermetallic Environmentally friendly manufacturing techniques Lead Soldering Gold Compressive stress Tensile stress Fabrication Bonding Isothermal processes
Content Type	Text
Resource Type	Article

Sl.	Authority	Responsibilities	Communication Details
1	Ministry of Education (GoI), Department of Higher Education	Sanctioning Authority	https://www.education.gov.in/ict-initiatives
2	Indian Institute of Technology Kharagpur	Host Institute of the Project: The host institute of the project is responsible for providing infrastructure support and hosting the project	https://www.iitkgp.ac.in
3	National Digital Library of India Office, Indian Institute of Technology Kharagpur	The administrative and infrastructural headquarters of the project	Dr. B. Sutradhar bsutra@ndl.gov.in
4	Project PI / Joint PI	Principal Investigator and Joint Principal Investigators of the project	Dr. B. Sutradhar bsutra@ndl.gov.in Prof. Saswat Chakrabarti will be added soon
5	Website/Portal (Helpdesk)	Queries regarding NDLI and its services	support@ndl.gov.in
6	Contents and Copyright Issues	Queries related to content curation and copyright issues	content@ndl.gov.in
7	National Digital Library of India Club (NDLI Club)	Queries related to NDLI Club formation, support, user awareness program, seminar/symposium, collaboration, social media, promotion, and outreach	clubsupport@ndl.gov.in
8	Digital Preservation Centre (DPC)	Assistance with digitizing and archiving copyright-free printed books	dpc@ndl.gov.in
9	IDR Setup or Support	Queries related to establishment and support of Institutional Digital Repository (IDR) and IDR workshops	idr@ndl.gov.in

Stress effect on growth of IMCs at interfaces between Sn-Ag-Cu lead free solder and Cu substrate

The influence of element-Ni on interfacial reactions between lead-free Sn-Ag-Cu and Cu substrate

Effect of ni and ag on interfacial reaction and microstructure of sn-ag-cu-ni-ge lead-free solder.

Effect of 0.05% Cr on intermetallic compound layer growth for Sn-Ag-Cu Lead-free Solder joint during isothermal aging

The Bonding of Sn-Zn-Ag-Al-Ga Lead-Free Solder Balls on Cu/Ni-P/Au BGA Substrate

Joint strength and interfacial microstructure between Sn–Ag–Cu and Sn–Zn–Bi solders and Cu substrate

Study of New Types Lead-Free Solder Alloys of Sn-Ag-Cu-Al-Ni and Sn-Zn-Bi-In-P

Influence of solder volume on interfacial reaction between Sn-Ag-Cu solder and TiW/Cu/Ni UBM

Intermetallic formation in the Sn-Ag solder joints between Au stud bumps and Cu pads and its effect on the chip shear strength

Effect of stress on interfacial intermetallic compound development of Sn-Ag-Cu lead-free solder joint on Au/Ni/Cu substrate

Similar Documents

Stress effect on growth of IMCs at interfaces between Sn-Ag-Cu lead free solder and Cu substrate

The influence of element-Ni on interfacial reactions between lead-free Sn-Ag-Cu and Cu substrate

Effect of ni and ag on interfacial reaction and microstructure of sn-ag-cu-ni-ge lead-free solder.

Effect of 0.05% Cr on intermetallic compound layer growth for Sn-Ag-Cu Lead-free Solder joint during isothermal aging

The Bonding of Sn-Zn-Ag-Al-Ga Lead-Free Solder Balls on Cu/Ni-P/Au BGA Substrate

Joint strength and interfacial microstructure between Sn–Ag–Cu and Sn–Zn–Bi solders and Cu substrate

Study of New Types Lead-Free Solder Alloys of Sn-Ag-Cu-Al-Ni and Sn-Zn-Bi-In-P

Influence of solder volume on interfacial reaction between Sn-Ag-Cu solder and TiW/Cu/Ni UBM

Intermetallic formation in the Sn-Ag solder joints between Au stud bumps and Cu pads and its effect on the chip shear strength

Effect of stress on interfacial intermetallic compound development of Sn-Ag-Cu lead-free solder joint on Au/Ni/Cu substrate