NDLI: Harsh solder joint reliability tests by impact drop and highly accelerated life test (HALT)

Content Provider	IEEE Xplore Digital Library
Author	Che, F.X. Pang, J.H.L.
Copyright Year	2004
Description	Author affiliation: Sch. of Mech. & Production Eng., Nanyang Technol. Univ., Singapore (Che, F.X.; Pang, J.H.L.)
Abstract	In this work, board level impact drop test and highly accelerated life test (HALT) were conducted on lead-free soldered assemblies. Harsh solder joint reliability testing are needed for impact drop requirements particularly for portable electronics. Highly accelerated life testing (HALT) is increasingly used for high-end workstation server systems. For drop test, the acceleration and strain were measured for clamped-clamped PCB assemblies along the longer edge. The failure criteria was set at a daisy chain resistance of 1000ohms. Bare PCB and populated PCB with BGA, QFP, TSSOP component with lead free Sn-3.8Ag-0.7Cu solder were investigated. Three different surface finishes such as Ag, Ni/Au and OSP are used for populated PCB. For populated PCB, drop height of 1m was fixed. HALT test was also conducted for populated PCB including high temperature storage, low temperature storage, thermal shock, random vibration, and combined thermal shock and random vibration tests. High-speed camera was used to capture dynamic response of the PCB and PQFP lead during random vibration test. The displacement result can be used in FEA analysis as input boundary condition.
Starting Page	205
Ending Page	209
File Size	403887
Page Count	5
File Format	PDF
ISBN	0780388216
DOI	10.1109/EPTC.2004.1396604
Language	English
Publisher	Institute of Electrical and Electronics Engineers, Inc. (IEEE)
Publisher Date	2004-12-08
Publisher Place	Singapore
Access Restriction	Subscribed
Rights Holder	Institute of Electrical and Electronics Engineers, Inc. (IEEE)
Subject Keyword	Life testing Soldering Life estimation Environmentally friendly manufacturing techniques Lead Assembly Electronic equipment testing Strain measurement Temperature Thermal conductivity
Content Type	Text
Resource Type	Article

Sl.	Authority	Responsibilities	Communication Details
1	Ministry of Education (GoI), Department of Higher Education	Sanctioning Authority	https://www.education.gov.in/ict-initiatives
2	Indian Institute of Technology Kharagpur	Host Institute of the Project: The host institute of the project is responsible for providing infrastructure support and hosting the project	https://www.iitkgp.ac.in
3	National Digital Library of India Office, Indian Institute of Technology Kharagpur	The administrative and infrastructural headquarters of the project	Dr. B. Sutradhar bsutra@ndl.gov.in
4	Project PI / Joint PI	Principal Investigator and Joint Principal Investigators of the project	Dr. B. Sutradhar bsutra@ndl.gov.in Prof. Saswat Chakrabarti will be added soon
5	Website/Portal (Helpdesk)	Queries regarding NDLI and its services	support@ndl.gov.in
6	Contents and Copyright Issues	Queries related to content curation and copyright issues	content@ndl.gov.in
7	National Digital Library of India Club (NDLI Club)	Queries related to NDLI Club formation, support, user awareness program, seminar/symposium, collaboration, social media, promotion, and outreach	clubsupport@ndl.gov.in
8	Digital Preservation Centre (DPC)	Assistance with digitizing and archiving copyright-free printed books	dpc@ndl.gov.in
9	IDR Setup or Support	Queries related to establishment and support of Institutional Digital Repository (IDR) and IDR workshops	idr@ndl.gov.in