NDLI: The study of OSP as reliable surface finish of BGA substrate

Content Provider	IEEE Xplore Digital Library
Author	Chang, D. Bai, F. Wang, Y.P. Hsiao, C.S.
Copyright Year	2004
Description	Author affiliation: Siliconware Precision Ind. Co. Ltd., Taichung, Taiwan (Chang, D.; Bai, F.; Wang, Y.P.; Hsiao, C.S.)
Abstract	OSPs(organic solderability preservatives) have been used as surface finish for over 20 years and continues to taken the place of HASL (hot air solder leveling) or other surface finish to ensure the solderability of printed circuit board (PCB)(Wengenroth and Stafstrom). It is a transparent organic complex film to coat onto copper surface to keep from corrosion of copper surface. The advantages of OSP are stronger solder joint, substrate low price, simple process and environment friendly. For BGA substrate surface finish, electrolytic Ni/Au and electroless Ni/Au are popular in packaging industry. To reduce the cost and solder joint embrittlement, OSP is getting popular in package assembly industry as BGA substrate surface finish, especially in CSP application. In this work, solder spreading is used to determine the wettability of Sn/3.OAg/O.5Cu with 3 kinds of flux. Flux B and C has higher activity and acidity that affected the solder wettability significantly. The thickness of OSP after each packaging process is measured by UV spectrophotometer. OSP discoloration is inspected after multi-reflow, N/sub 2/ implement and packaging process. After packaging process, the ball shear test, IMC growth analysis and failure mode as aging conditions were implemented to evaluate the OSP performance. Finally, these OSP packages mounted onto PCB to evaluate solder joint reliability by board level drop test.
Starting Page	149
Ending Page	153
File Size	390740
Page Count	5
File Format	PDF
ISBN	0780388216
DOI	10.1109/EPTC.2004.1396594
Language	English
Publisher	Institute of Electrical and Electronics Engineers, Inc. (IEEE)
Publisher Date	2004-12-08
Publisher Place	Singapore
Access Restriction	Subscribed
Rights Holder	Institute of Electrical and Electronics Engineers, Inc. (IEEE)
Subject Keyword	Surface finishing Packaging Substrates Soldering Copper Gold Testing Printed circuits Corrosion Costs
Content Type	Text
Resource Type	Article

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Board Level Thermal Cycle Reliability of BGA for a New Type of Pad Structure with OSP Surface Finish

Thermal cyclic fatigue of the interconnect of a flex-type BGA

Gold embrittlement of solder joints in wafer level chip scale package on printed circuit board with Ni/Au surface finish

Effect of Sb addition in Sn-Ag-Cu solder balls on the drop test reliability of BGA packages with electroless nickel immersion gold (ENIG) surface finish

Solder joint integrity of various surface finished build-up flip chip packages by 4-point monotonic bending test

A new approach to chip size package using meniscus soldering and FPC-bonding

Soldering on gold plated substrates-solder joint reliability and integrity of surface components

Discoloration related failure mechanism and its root cause in electroless nickel immersion gold (ENIG) pad metallurgical surface finish

Thin electroless Cu/OSP on electroless Ni as a novel surface finish for flip chip solder joints

The study of OSP as reliable surface finish of BGA substrate

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