NDLI: Process development of a flip chip in package with anisotropic conductive film (ACF) for lead-free soldering

Content Provider	IEEE Xplore Digital Library
Author	Lim Pei Siang, S. Tan Ai Min Lee, C.
Copyright Year	2004
Description	Author affiliation: Assembly & Interconnect Technol., Infineon Technol. Asia Pacific Pte Ltd., Singapore, Singapore (Lim Pei Siang, S.; Tan Ai Min; Lee, C.)
Abstract	In our previous work, we have established a baseline anisotropic conductive adhesive (ACA) assembly process with positive temperature cycling and temperature humidity reliability results. With the experience gained, further work was carried out to assess the compatibility of anisotropic conductive film (ACF) technology for high I/O applications in lead-free soldering conditions. Here, we report the assembly process development of a 13mm /spl times/ 13mm flip chip BGA package using ACF to meet the stringent reflow temperature of 260/spl deg/C, required for lead-free soldering. The effects of bond pressure distribution and alignment accuracy was found to be more critical in this 8mm /spl times/ 8mm test die and 800 flip chip bumps. A three-factor design of experiment (DOE) was carried out to investigate the effects of assembly parameters such as bonding pressure, temperature and time on moisture sensitivity level (MSL) performance reflowed at 260/spl deg/C. Results showed that higher bond force is undesirable and contributes to delamination at critical interfaces. With process optimization, the flip chip BGA with large die and high I/O was able to meet lead-free soldering requirement.
Starting Page	450
Ending Page	454
File Size	393777
Page Count	5
File Format	PDF
ISBN	0780388216
DOI	10.1109/EPTC.2004.1396650
Language	English
Publisher	Institute of Electrical and Electronics Engineers, Inc. (IEEE)
Publisher Date	2004-12-08
Publisher Place	Singapore
Access Restriction	Subscribed
Rights Holder	Institute of Electrical and Electronics Engineers, Inc. (IEEE)
Subject Keyword	Flip chip Packaging Anisotropic conductive films Environmentally friendly manufacturing techniques Lead Soldering Assembly Temperature Bonding Anisotropic magnetoresistance
Content Type	Text
Resource Type	Article

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