NDLI: Modeling of solder joint failure due to PCB bending during drop impact

Content Provider	IEEE Xplore Digital Library
Author	Gu Jie Lim, C.T. Tay, A.A.O.
Copyright Year	2004
Description	Author affiliation: Dept. of Mech. Eng., Nat. Univ. of Singapore (Gu Jie; Lim, C.T.; Tay, A.A.O.)
Abstract	Reliability of IC packages during drop impact is critical for portable electronic products. These packages are susceptible to solder joint failure when induced by mechanical shock and printed circuit board (PCB) bending during impact. Normally, portable products are designed to withstand a few accidental drops without resulting in major mechanical failure. In this study, we use the ABAQUS/EXPLICIT finite element software to perform the dynamic drop impact simulation. We will use the equivalent layer model for the array of solder columns to simplify the modeling problem. From the analysis, we are able to examine the effects of PCB bending arising from the different number of screws used and the effect of chip location. It is found that PCB bending curvature determines the stress states induced in the solder columns of the IC packages mounted at different locations in the PCB. In addition, the PCB bending curvature can also be used to predict the critical locations where the solder columns will fail first
Starting Page	678
Ending Page	683
File Size	417077
Page Count	6
File Format	PDF
ISBN	0780388216
DOI	10.1109/EPTC.2004.1396694
Language	English
Publisher	Institute of Electrical and Electronics Engineers, Inc. (IEEE)
Publisher Date	2004-12-08
Publisher Place	Singapore
Access Restriction	Subscribed
Rights Holder	Institute of Electrical and Electronics Engineers, Inc. (IEEE)
Subject Keyword	Soldering Electronics packaging Integrated circuit packaging Electric shock Printed circuits Product design Finite element methods Software performance Circuit simulation Fasteners
Content Type	Text
Resource Type	Article

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4	Project PI / Joint PI	Principal Investigator and Joint Principal Investigators of the project	Dr. B. Sutradhar bsutra@ndl.gov.in Prof. Saswat Chakrabarti will be added soon
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