NDLI: Drop test reliability assessment of leaded & lead-free solder joints for IC packages

Content Provider	IEEE Xplore Digital Library
Author	Chong, D.Y.R. Ng, K. Tan, J.Y.N. Low, P.T.H. Pang, J.H.L. Che, F.X.
Copyright Year	2004
Description	Author affiliation: Packaging Anal. & Design Center, United Test & Assembly Center Ltd. (Chong, D.Y.R.; Ng, K.; Tan, J.Y.N.; Low, P.T.H.; Pang, J.H.L.; Che, F.X.)
Abstract	With the development of smaller and higher density surface mount packages like quad flat no-lead (QFN) and ball grid array (BGA), solder joints strength of the electronic components has a greater impact on the reliability of an end product. And the decrease in size of consumer products such as cellular phones, PDAs, and MP3 players has increased the frequency of accidental drops resulting in solder joint cracks and eventually malfunction of the products. With legislation put in place by government and industrial bodies, electronics companies are driven to eliminate the uses of lead in their products. It thus leads to the concern of reliability of lead-free solders as interconnects. The present work aims at studying the effects of drop impact on the reliability of solder interconnects of leaded (36Pb62Sn2Ag) and lead-free (Sn4AgO.5Cu) compositions. The influence of different package types and the impact of PCB surface finishes of OSP and ENIG (electroless nickel immersion gold) have also been looked into. The drop test results has shown that lead-free solder joints on the ENIG finish have weaker drop reliability performance compared to the leaded and lead-free solders on an OSP finish
Starting Page	210
Ending Page	217
File Size	585212
Page Count	8
File Format	PDF
ISBN	0780388216
DOI	10.1109/EPTC.2004.1396606
Language	English
Publisher	Institute of Electrical and Electronics Engineers, Inc. (IEEE)
Publisher Date	2004-12-08
Publisher Place	Singapore
Access Restriction	Subscribed
Rights Holder	Institute of Electrical and Electronics Engineers, Inc. (IEEE)
Subject Keyword	Environmentally friendly manufacturing techniques Lead Integrated circuit testing Soldering Integrated circuit packaging Electronics packaging Electronic components Consumer products Cellular phones Personal digital assistants
Content Type	Text
Resource Type	Article

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