NDLI: Use of the area-of-spread method for monitoring the stability of reflow furnaces

Content Provider	IEEE Xplore Digital Library
Author	Ekere, N.N. Lawson, W.
Copyright Year	1999
Description	Author affiliation: Dept. of Aeronaut. Mech. & Manuf. Eng., Salford Univ., UK (Ekere, N.N.)
Abstract	In this paper, we investigate the use of the area of spread (AOS) method for the assessment of wetting parameters which can be used as a guide to the solderability of PCB pad surfaces in reflow soldering. In the AOS method, the wetting (and hence solderability) of the PCB pad surface is assessed by measuring the area over which a given mass of fluxed solder spreads on a sample PCB pad at a given temperature (in excess of the solder melting point) and in a given time. Although the reflow soldering technique has been around for quite a number of years, and has been used in the assembly of surface mount devices, there are very few methods available for the on-line monitoring and assessment of solderability. There are a large number of off-line solderability assessment techniques, such as the solder dip method, the wetting balance method and the globule balance method. Although these methods are quite useful for process characterisation, they are not suitable for monitoring the process stability of the reflow furnace over time. This paper discusses the use of an area-of-spread experiment as a means of measuring the stability of the reflow process using statistical process control (SPC) methods. It is expected that this methodology will be applicable for process control and monitoring activities to expedite the development and efficient operation of reflow soldering systems. An improved method of measuring the area-of-spread of solder paste is used in the experiment from which quantitative results can be produced for reflow oven control data.
Starting Page	115
Ending Page	119
File Size	561347
Page Count	5
File Format	PDF
ISBN	0780355024
ISSN	10898190
DOI	10.1109/IEMT.1999.804804
Language	English
Publisher	Institute of Electrical and Electronics Engineers, Inc. (IEEE)
Publisher Date	1999-10-19
Access Restriction	Subscribed
Rights Holder	Institute of Electrical and Electronics Engineers, Inc. (IEEE)
Subject Keyword	Monitoring Stability Reflow soldering Area measurement Process control Time measurement Temperature Assembly Furnaces Ovens
Content Type	Text
Resource Type	Article
Subject	Industrial and Manufacturing Engineering Electrical and Electronic Engineering

Sl.	Authority	Responsibilities	Communication Details
1	Ministry of Education (GoI), Department of Higher Education	Sanctioning Authority	https://www.education.gov.in/ict-initiatives
2	Indian Institute of Technology Kharagpur	Host Institute of the Project: The host institute of the project is responsible for providing infrastructure support and hosting the project	https://www.iitkgp.ac.in
3	National Digital Library of India Office, Indian Institute of Technology Kharagpur	The administrative and infrastructural headquarters of the project	Dr. B. Sutradhar bsutra@ndl.gov.in
4	Project PI / Joint PI	Principal Investigator and Joint Principal Investigators of the project	Dr. B. Sutradhar bsutra@ndl.gov.in Prof. Saswat Chakrabarti will be added soon
5	Website/Portal (Helpdesk)	Queries regarding NDLI and its services	support@ndl.gov.in
6	Contents and Copyright Issues	Queries related to content curation and copyright issues	content@ndl.gov.in
7	National Digital Library of India Club (NDLI Club)	Queries related to NDLI Club formation, support, user awareness program, seminar/symposium, collaboration, social media, promotion, and outreach	clubsupport@ndl.gov.in
8	Digital Preservation Centre (DPC)	Assistance with digitizing and archiving copyright-free printed books	dpc@ndl.gov.in
9	IDR Setup or Support	Queries related to establishment and support of Institutional Digital Repository (IDR) and IDR workshops	idr@ndl.gov.in

Automated adaptive control of the reflow soldering of electronic assemblies

Thermal limits in reflow soldering process

A process model of the infra-red reflow soldering of printed circuit board assemblies

Self-teaching setup for reflow soldering process

Thermal conductivity influence in SMT reflow soldering process

Evaluation of Reflow Ovens for Lead-Free Soldering

Temperature distribution in IC plastic packages in the reflow soldering process

Thermal simulation for predicting substrate temperature during reflow soldering process

A Novel On-board Temperature Monitoring Approach in the Reflow Soldering Process

Use of the area-of-spread method for monitoring the stability of reflow furnaces

Similar Documents

Automated adaptive control of the reflow soldering of electronic assemblies

Thermal limits in reflow soldering process

A process model of the infra-red reflow soldering of printed circuit board assemblies

Self-teaching setup for reflow soldering process

Thermal conductivity influence in SMT reflow soldering process

Evaluation of Reflow Ovens for Lead-Free Soldering

Temperature distribution in IC plastic packages in the reflow soldering process

Thermal simulation for predicting substrate temperature during reflow soldering process

A Novel On-board Temperature Monitoring Approach in the Reflow Soldering Process

Use of the area-of-spread method for monitoring the stability of reflow furnaces