NDLI: Flip-chip on flex for 3D packaging

Content Provider	IEEE Xplore Digital Library
Author	Clot, P. Zeberli, J.-F. Chenuz, J.-M. Ferrando, F. Styblo, D.
Copyright Year	1999
Description	Author affiliation: Valtronic SA, Les Charbonnieres, Switzerland (Clot, P.)
Abstract	In order to respond to the need for extreme miniaturization, a flip-chip process has been developed. Valtronic is using nonconductive adhesive to attach stud bumped dice without additional underfill. This original process can be applied on rigid and flexible PWBs and is described in this paper. Using a test vehicle, a qualification test program was conducted in order to quantify the limits of the process and verify all specifications required by specific markets such as industrial or medical. The flip-chip process adapts well to flexible polyimide substrates. This enables the flip-chip to be applicable to a wide range of applications, particularly for 3D packaging. First, dice are connected using a flip-chip process on a flat substrate on the flexible circuit. Next, the third dimension is obtained by bending and/or rolling the substrate on itself, accomplishing a 3D package. Finally, the package is completed by soldering on dedicated traces and filling with epoxy if required. This innovative package looks like CSP, where miniature solder balls allow the package to be attached to another substrate (motherboard) through the reflow process. Furthermore, the process offers the possibility of adding SMD components on the back side of the flip-chip areas. To develop this bending/folding method, a full scale module was assembled with daisy chain die. This module was used to evaluate the flip-chip interconnect reliability before and after bending. Finally, a cubical hearing aid module was developed and industrialized. Its final dimensions are 4.5/spl times/4.0/spl times/3.0 mm. The module contains 3 ICs and 18 SMDs.
Starting Page	36
Ending Page	41
File Size	938683
Page Count	6
File Format	PDF
ISBN	0780355024
ISSN	10898190
DOI	10.1109/IEMT.1999.804793
Language	English
Publisher	Institute of Electrical and Electronics Engineers, Inc. (IEEE)
Publisher Date	1999-10-19
Access Restriction	Subscribed
Rights Holder	Institute of Electrical and Electronics Engineers, Inc. (IEEE)
Subject Keyword	Medical tests Nonconductive adhesives Vehicles Qualifications Polyimides Flexible printed circuits Soldering Filling Chip scale packaging Back
Content Type	Text
Resource Type	Article
Subject	Industrial and Manufacturing Engineering Electrical and Electronic Engineering

Sl.	Authority	Responsibilities	Communication Details
1	Ministry of Education (GoI), Department of Higher Education	Sanctioning Authority	https://www.education.gov.in/ict-initiatives
2	Indian Institute of Technology Kharagpur	Host Institute of the Project: The host institute of the project is responsible for providing infrastructure support and hosting the project	https://www.iitkgp.ac.in
3	National Digital Library of India Office, Indian Institute of Technology Kharagpur	The administrative and infrastructural headquarters of the project	Dr. B. Sutradhar bsutra@ndl.gov.in
4	Project PI / Joint PI	Principal Investigator and Joint Principal Investigators of the project	Dr. B. Sutradhar bsutra@ndl.gov.in Prof. Saswat Chakrabarti will be added soon
5	Website/Portal (Helpdesk)	Queries regarding NDLI and its services	support@ndl.gov.in
6	Contents and Copyright Issues	Queries related to content curation and copyright issues	content@ndl.gov.in
7	National Digital Library of India Club (NDLI Club)	Queries related to NDLI Club formation, support, user awareness program, seminar/symposium, collaboration, social media, promotion, and outreach	clubsupport@ndl.gov.in
8	Digital Preservation Centre (DPC)	Assistance with digitizing and archiving copyright-free printed books	dpc@ndl.gov.in
9	IDR Setup or Support	Queries related to establishment and support of Institutional Digital Repository (IDR) and IDR workshops	idr@ndl.gov.in

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