NDLI: Correlating solder paste composition with stencil printing performance

Content Provider	IEEE Xplore Digital Library
Author	Nguty, T.A. Ekere, N.N. Adebayo, A.
Copyright Year	1999
Description	Author affiliation: Dept. of Aeronaut. Mech. & Manuf. Eng., Salford Univ., UK (Nguty, T.A.)
Abstract	Soldering technologies continue to evolve, particularly in the area of solder pastes used in SMD reflow soldering. Solder pastes typically consist of solder alloy powder, flux, viscosity control agents, and a solvent system. By varying solder particle size, distribution and shape, as well as the other constituent materials, solder paste rheology and printing performance can be controlled. As PCB pad and component lead sizes reduce to meet ultra-fine pitch and flip-chip assembly requirements, most paste suppliers have opted for smaller powder particle sizes and new rheology modifier formulations. Successful assembly at these small-scale geometries requires deposition of small and consistent paste deposits from pad to pad, and from board to board. Two primary mechanisms dominate paste printing at this chip-scale geometry: paste transfer into stencil apertures, and paste release from the apertures on to PCB pads, i.e. paste flow behaviour is crucial in defining printing performance. Solder paste flow properties primarily depend on their chemical and physical structure, and hence composition. In this paper, we study the rheological profile of various paste formulations, and how this can be used to provide better understanding of composition effects on stencil printing performance. Pastes for ultra-fine pitch and flip chip applications were studied via a wide range of rheological tests, including the creep recovery test to determine paste slump characteristics and the oscillatory test to determine visco-elastic behaviour required for two critical sub-processes: aperture filling and paste withdrawal.
Starting Page	304
Ending Page	312
File Size	1087091
Page Count	9
File Format	PDF
ISBN	0780355024
ISSN	10898190
DOI	10.1109/IEMT.1999.804837
Language	English
Publisher	Institute of Electrical and Electronics Engineers, Inc. (IEEE)
Publisher Date	1999-10-19
Access Restriction	Subscribed
Rights Holder	Institute of Electrical and Electronics Engineers, Inc. (IEEE)
Subject Keyword	Printing Rheology Apertures Testing Powders Shape control Assembly Geometry Reflow soldering Viscosity
Content Type	Text
Resource Type	Article
Subject	Industrial and Manufacturing Engineering Electrical and Electronic Engineering

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1	Ministry of Education (GoI), Department of Higher Education	Sanctioning Authority	https://www.education.gov.in/ict-initiatives
2	Indian Institute of Technology Kharagpur	Host Institute of the Project: The host institute of the project is responsible for providing infrastructure support and hosting the project	https://www.iitkgp.ac.in
3	National Digital Library of India Office, Indian Institute of Technology Kharagpur	The administrative and infrastructural headquarters of the project	Dr. B. Sutradhar bsutra@ndl.gov.in
4	Project PI / Joint PI	Principal Investigator and Joint Principal Investigators of the project	Dr. B. Sutradhar bsutra@ndl.gov.in Prof. Saswat Chakrabarti will be added soon
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