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| Content Provider | IEEE Xplore Digital Library |
|---|---|
| Author | Scharr, T.A. |
| Copyright Year | 1991 |
| Description | Author affiliation: Motorola Inc., Phoenix, AZ, USA (Scharr, T.A.) |
| Abstract | An attempt was made to characterize the mechanical properties of various types of copper foils that are used for TAB (tape automated bonding) fabrication with a special emphasis on fatigue properties. Coffin-Manson plots of strain range versus cycles-to-failure and fatigue ductility values were generated from testing of specimens. In general, the wrought foils showed a high degree of anisotropy with up to a 5 to 1 difference in cycles-to-failure between machined and cross-machined directions. The anisotropy was observed to be much lower in the low-temperature annealable wrought foils, about 1.5 to 1. Observed grain structures of these materials correlated to their anisotropic behavior, with the low-temperature annealable materials showing smaller amounts of directionality in their microstructure. The ED (electrodeposited) coppers tested had fine-grained equiaxial structures with no significant effects from direction of test. Of the samples tested, the ED coppers performed better at low-cycle, high strain rates, while the wrought coppers had the best performance at high-cycle, low strain rates. The results of this work show that the fatigue performance of a particular type or temper of copper is an important consideration when designing a TAB tape.< |
| Starting Page | 848 |
| Ending Page | 853 |
| File Size | 392289 |
| Page Count | 6 |
| File Format | |
| ISBN | 0780300122 |
| DOI | 10.1109/ECTC.1991.163978 |
| Language | English |
| Publisher | Institute of Electrical and Electronics Engineers, Inc. (IEEE) |
| Publisher Date | 1991-05-11 |
| Publisher Place | USA |
| Access Restriction | Subscribed |
| Rights Holder | Institute of Electrical and Electronics Engineers, Inc. (IEEE) |
| Subject Keyword | Fatigue Copper Fabrication Testing Capacitive sensors Anisotropic magnetoresistance Mechanical factors Annealing Bonding Microstructure |
| Content Type | Text |
| Resource Type | Article |
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