NDLI: Complications in life prediction estimates at elevated temperatures in lead/tin solders during accelerated cycling

Content Provider	IEEE Xplore Digital Library
Author	Tien, J.K. Attarwala, A.I.
Copyright Year	1991
Description	Author affiliation: Strategic Mater. R&D Lab., Texas Univ., Austin, TX, USA (Tien, J.K.; Attarwala, A.I.)
Abstract	It was reported previously that cyclically tested Pb/Sn solders of different compositions exhibited a complicating anelastic effect. The storage and recovery of anelastic strains suppress damaging creep strain from being stored, thus causing nonconservative life prediction estimates, and result in complications with respect to accelerated testing. These complications were at that time believed to be characteristic of only eutectic solders at near ambient temperatures. It is now found that these complications exist for high-end Pb solders and at higher temperatures. Experiments done on 90/10 Pb/Sn solder indicate that the anelastic strains are not due to an interaction between the lead and tin phases. This leads to the conclusion that grain morphology would play an important role in determining anelastic responses in solder. The effect of grain size on accelerated cycling is also discussed.<>
Starting Page	667
Ending Page	670
File Size	260244
Page Count	4
File Format	PDF
ISBN	0780300122
DOI	10.1109/ECTC.1991.163951
Language	English
Publisher	Institute of Electrical and Electronics Engineers, Inc. (IEEE)
Publisher Date	1991-05-11
Publisher Place	USA
Access Restriction	Subscribed
Rights Holder	Institute of Electrical and Electronics Engineers, Inc. (IEEE)
Subject Keyword	Life estimation Temperature Lead Tin Capacitive sensors Testing Creep Morphology Grain size Acceleration
Content Type	Text
Resource Type	Article

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