NDLI: A multilevel epoxy substrate for flip-chip hybrid multichip module applications

Content Provider	IEEE Xplore Digital Library
Author	Tsunashima, E. Okuno, A.
Copyright Year	1991
Description	Author affiliation: Matsushita Electron. Corp., Kyoto, Japan (Tsunashima, E.)
Abstract	A multilevel substrate consisting of two portions of a multiple multilayer is discussed. One portion is thicker than the other, reinforced by organic fiber in each layer; the other is an unreinforced thick film which forms low dielectric-constant layers. A sophisticated epoxy-resin two-dimensional support, but its adhesion strength between the epoxy layers, stabilizes the elongation, shrink and warp by one-order smaller compared to the substrate of FR-4 with inorganic reinforcement. The resin of an aromatic-amine adducted type may lower the dielectric constant making it suitable for high-frequency circuits and it is an excellent acceptor of both copper-foil and copper-plated electrodes. This two-portion substrate enables ideal flip-chip bonding on thick-film hybrid circuits, gives the necessary impedance of semiconductor-circuit, and leaves a compatible zone for wire bonding and a reflow soldering.<>
Starting Page	593
Ending Page	596
File Size	331667
Page Count	4
File Format	PDF
ISBN	0780300122
DOI	10.1109/ECTC.1991.163939
Language	English
Publisher	Institute of Electrical and Electronics Engineers, Inc. (IEEE)
Publisher Date	1991-05-11
Publisher Place	USA
Access Restriction	Subscribed
Rights Holder	Institute of Electrical and Electronics Engineers, Inc. (IEEE)
Subject Keyword	Multichip modules Dielectric substrates Circuits Bonding Nonhomogeneous media Thick films Adhesives Resins Dielectric constant Electrodes
Content Type	Text
Resource Type	Article

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